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Improved adhesion of gold thin films evaporated on polymer resin: applications for sensing surfaces and MEMS.


ABSTRACT: We present and analyze a method to improve the morphology and mechanical properties of gold thin films for use in optical sensors or other settings where good adhesion of gold to a substrate is of importance and where controlled topography/roughness is key. To improve the adhesion of thermally evaporated gold thin films, we introduce a gold deposition step on SU-8 photoresist prior to UV exposure but after the pre-bake step of SU-8 processing. Shrinkage and distribution of residual stresses, which occur during cross-linking of the SU-8 polymer layer in the post-exposure baking step, are responsible for the higher adhesion of the top gold film to the post-deposition cured SU-8 sublayer. The SU-8 underlayer can also be used to tune the resulting gold film morphology. Our promoter-free protocol is easily integrated with existing sensor microfabrication processes.

SUBMITTER: Moazzez B 

PROVIDER: S-EPMC3715244 | biostudies-literature | 2013 May

REPOSITORIES: biostudies-literature

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Improved adhesion of gold thin films evaporated on polymer resin: applications for sensing surfaces and MEMS.

Moazzez Behrang B   O'Brien Stacey M SM   Merschrod S Erika F EF  

Sensors (Basel, Switzerland) 20130528 6


We present and analyze a method to improve the morphology and mechanical properties of gold thin films for use in optical sensors or other settings where good adhesion of gold to a substrate is of importance and where controlled topography/roughness is key. To improve the adhesion of thermally evaporated gold thin films, we introduce a gold deposition step on SU-8 photoresist prior to UV exposure but after the pre-bake step of SU-8 processing. Shrinkage and distribution of residual stresses, whi  ...[more]

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