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Peel-and-stick: mechanism study for efficient fabrication of flexible/transparent thin-film electronics.

ABSTRACT: Peel-and-stick process, or water-assisted transfer printing (WTP), represents an emerging process for transferring fully fabricated thin-film electronic devices with high yield and fidelity from a SiO2/Si wafer to various non-Si based substrates, including papers, plastics and polymers. This study illustrates that the fundamental working principle of the peel-and-stick process is based on the water-assisted subcritical debonding, for which water reduces the critical adhesion energy of metal-SiO2 interface by 70 ~ 80%, leading to clean and high quality transfer of thin-film electronic devices. Water-assisted subcritical debonding is applicable for a range of metal-SiO2 interfaces, enabling the peel-and-stick process as a general and tunable method for fabricating flexible/transparent thin-film electronic devices.

SUBMITTER: Lee CH

PROVIDER: S-EPMC3794378 | biostudies-literature | 2013

REPOSITORIES: biostudies-literature

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Peel-and-stick: mechanism study for efficient fabrication of flexible/transparent thin-film electronics.

Lee Chi Hwan CH Kim Jae-Han JH Zou Chenyu C Cho In Sun IS Weisse Jeffery M JM Nemeth William W Wang Qi Q van Duin Adri C T AC Kim Taek-Soo TS Zheng Xiaolin X

Scientific reports 20131010

Peel-and-stick process, or water-assisted transfer printing (WTP), represents an emerging process for transferring fully fabricated thin-film electronic devices with high yield and fidelity from a SiO2/Si wafer to various non-Si based substrates, including papers, plastics and polymers. This study illustrates that the fundamental working principle of the peel-and-stick process is based on the water-assisted subcritical debonding, for which water reduces the critical adhesion energy of metal-SiO2 ...[more]

PMID: 24108063

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