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Reusable three-dimensional nanostructured substrates for surface-enhanced Raman scattering.

ABSTRACT: To date, fabricating three-dimensional (3D) nanostructured substrate with small nanogap was a laborious challenge by conventional fabrication techniques. In this article, we address a simple, low-cost, large-area, and spatially controllable method to fabricate 3D nanostructures, involving hemisphere, hemiellipsoid, and pyramidal pits based on nanosphere lithography (NSL). These 3D nanostructures were used as surface-enhanced Raman scattering (SERS) substrates of single Rhodamine 6G (R6G) molecule. The average SERS enhancement factor achieved up to 1011. The inevitably negative influence of the adhesion-promoting intermediate layer of Cr or Ti was resolved by using such kind of 3D nanostructures. The nanostructured quartz substrate is a free platform as a SERS substrate and is nondestructive when altering with different metal films and is recyclable, which avoids the laborious and complicated fabricating procedures.

SUBMITTER: Zhu Z

PROVIDER: S-EPMC3898998 | biostudies-literature | 2014 Jan

REPOSITORIES: biostudies-literature

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Reusable three-dimensional nanostructured substrates for surface-enhanced Raman scattering.

Zhu Zhendong Z Li Qunqing Q Bai Benfeng B Fan Shoushan S

Nanoscale research letters 20140113 1

To date, fabricating three-dimensional (3D) nanostructured substrate with small nanogap was a laborious challenge by conventional fabrication techniques. In this article, we address a simple, low-cost, large-area, and spatially controllable method to fabricate 3D nanostructures, involving hemisphere, hemiellipsoid, and pyramidal pits based on nanosphere lithography (NSL). These 3D nanostructures were used as surface-enhanced Raman scattering (SERS) substrates of single Rhodamine 6G (R6G) molecul ...[more]

PMID: 24417892

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Project description:The unique attributes of surface enhanced Raman spectroscopy (SERS) make it well suited to address the challenges associated with portable diagnostics. However, despite the remarkable progress in this field, where the instrumentation has made great strides forward providing a route to the miniaturization of sensing devices, to date producing three-dimensional low-cost SERS substrates which simultaneously fulfill the multitude of criteria of high sensitivity, reproducibility, tunability, multiplexity, and integratability for rapid sensing has not yet been accomplished. Successful implementation of SERS requires readily fine-tuned nanostructures, which create a high enhancement. Here, an advanced electrofluidynamic patterning (EFDP) technique enables rapid fabrication of SERS active topographic morphologies with high throughput and at a nanoresolution via the spatial and lateral modulation of the dielectric discontinuity due to the high electric field generated across the polymer nanofilm and air gap. The subsequent formation of displacement charges within the nanofilm by coupling to the electric field yield a destabilizing electrostatic pressure and amplification of EFDP instabilities enabling the controllable pattern formation. The top of each gold coated EFDP fabricated pillar generates controllable high SERS enhancement by coupling of surface plasmon modes on top of the pillar, with each nanostructure acting as an individual sensing unit. The absolute enhancement factor depends on the topology as well as the tunable dimensions of the nanostructured units, and these are optimized in the design and engineering of the dedicated EFDP apparatus for reproducible, low-cost fabrication of the three-dimensional nanoarchitectures on macrosurfaces, rendering them for easy integration in further lab-on-a-chip devices. This unique combination of nanomaterials and nanospectroscopic systems lay the platform for a variety of applications in chemical and biological sensing.

Dataset Information

Reusable three-dimensional nanostructured substrates for surface-enhanced Raman scattering.

Publications

Reusable three-dimensional nanostructured substrates for surface-enhanced Raman scattering.

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