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Nanofabrication on unconventional substrates using transferred hard masks.


ABSTRACT: A major challenge in nanofabrication is to pattern unconventional substrates that cannot be processed for a variety of reasons, such as incompatibility with spin coating, electron beam lithography, optical lithography, or wet chemical steps. Here, we present a versatile nanofabrication method based on re-usable silicon membrane hard masks, patterned using standard lithography and mature silicon processing technology. These masks, transferred precisely onto targeted regions, can be in the millimetre scale. They allow for fabrication on a wide range of substrates, including rough, soft, and non-conductive materials, enabling feature linewidths down to 10 nm. Plasma etching, lift-off, and ion implantation are realized without the need for scanning electron/ion beam processing, UV exposure, or wet etching on target substrates.

SUBMITTER: Li L 

PROVIDER: S-EPMC4295112 | biostudies-literature | 2015

REPOSITORIES: biostudies-literature

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Nanofabrication on unconventional substrates using transferred hard masks.

Li Luozhou L   Bayn Igal I   Lu Ming M   Nam Chang-Yong CY   Schröder Tim T   Stein Aaron A   Harris Nicholas C NC   Englund Dirk D  

Scientific reports 20150115


A major challenge in nanofabrication is to pattern unconventional substrates that cannot be processed for a variety of reasons, such as incompatibility with spin coating, electron beam lithography, optical lithography, or wet chemical steps. Here, we present a versatile nanofabrication method based on re-usable silicon membrane hard masks, patterned using standard lithography and mature silicon processing technology. These masks, transferred precisely onto targeted regions, can be in the millime  ...[more]

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