Ontology highlight
ABSTRACT:
SUBMITTER: Wu F
PROVIDER: S-EPMC4929471 | biostudies-literature | 2016 Jul
REPOSITORIES: biostudies-literature
Wu Fan F Cai Wei W Gao Jia J Loo Yueh-Lin YL Yao Nan N
Scientific reports 20160701
Cu3Ge has been pursued as next-generation interconnection/contact material due to its high thermal stability, low bulk resistivity and diffusion barrier property. Improvements in electrical performance and structure of Cu3Ge have attracted great attention in the past decades. Despite the remarkable progress in Cu3Ge fabrication on various substrates by different deposition methods, polycrystalline films with excess Ge were frequently obtained. Moreover, the characterization of nanoscale electric ...[more]