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Interface crack between different orthotropic media under uniform heat flow.

ABSTRACT: In this paper, plane thermo-elastic solutions are presented for the problem of a crack in two bonded homogeneous orthotropic media with a graded interfacial zone. The graded interfacial zone is treated as a nonhomogeneous interlayer having spatially varying thermo-elastic moduli between dissimilar, homogeneous orthotropic half-planes, which is assumed to vary exponentially in the direction perpendicular to the crack surface. Using singular integral equation method, the mixed boundary value conditions with respect to the temperature field and those with respect to the stress field are reduced to a system of singular integral equations and solved numerically. Numerical results are obtained to show the influence of non-homogeneity parameters of the material thermo-elastic properties, the orthotropy parameters and the dimensionless thermal resistance on the temperature distribution and the thermal stress intensity factors.

SUBMITTER: Ding SH

PROVIDER: S-EPMC5011473 | biostudies-literature | 2016

REPOSITORIES: biostudies-literature

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Interface crack between different orthotropic media under uniform heat flow.

Ding Sheng-Hu SH Li Xing X

SpringerPlus 20160906 1

In this paper, plane thermo-elastic solutions are presented for the problem of a crack in two bonded homogeneous orthotropic media with a graded interfacial zone. The graded interfacial zone is treated as a nonhomogeneous interlayer having spatially varying thermo-elastic moduli between dissimilar, homogeneous orthotropic half-planes, which is assumed to vary exponentially in the direction perpendicular to the crack surface. Using singular integral equation method, the mixed boundary value condi ...[more]

PMID: 27652063

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Project description:Chlorophyll fluorescence (ChlF) parameters are reliable early stress indicators in crops, but their relations with yield are still not clear. The aims of this study are to examine genetic correlations between photosynthetic performance of JIP-test during flowering and grain yield (GY) in maize grown under two heat scenarios in the field environments applying quantitative genetic analysis, and to compare efficiencies of indirect selection for GY through ChlF parameters and genomic selection for GY. The testcrosses of 221 intermated recombinant inbred lines (IRILs) of the IBM Syn4 population were evaluated in six environments at two geographically distinctive locations in 3 years. According to day/night temperatures and vapor pressure deficit (VPD), the two locations in Croatia and Turkey may be categorized to the mild heat and moderate heat scenarios, respectively. Mild heat scenario is characterized by daytime temperatures often exceeding 33°C and night temperatures lower than 20°C while in moderate heat scenario the daytime temperatures often exceeded 33°C and night temperatures were above 20°C. The most discernible differences among the scenarios were obtained for efficiency of electron transport beyond quinone A (QA) [ET/(TR-ET)], performance index on absorption basis (PIABS) and GY. Under the moderate heat scenario, there were tight positive genetic correlations between ET/(TR-ET) and GY (0.73), as well as between PIABS and GY (0.59). Associations between the traits were noticeably weaker under the mild heat scenario. Analysis of quantitative trait loci (QTL) revealed several common QTLs for photosynthetic and yield performance under the moderate heat scenario corroborating pleiotropy. Although the indirect selection with ChlF parameters is less efficient than direct selection, ET/(TR-ET) and PIABS could be efficient secondary breeding traits for selection under moderate heat stress since they seem to be genetically correlated with GY in the stressed environments and not associated with yield performance under non-stressed conditions predicting GY during flowering. Indirect selection through PIABS was also shown to be more efficient than genomic selection in moderate heat scenario.

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Interface crack between different orthotropic media under uniform heat flow.

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Interface crack between different orthotropic media under uniform heat flow.

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