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Crosslinked polyarylene ether nitrile film as flexible dielectric materials with ultrahigh thermal stability.


ABSTRACT: Dielectric film with ultrahigh thermal stability based on crosslinked polyarylene ether nitrile is prepared and characterized. The film is obtained by solution-casting of polyarylene ether nitrile terminated phthalonitrile (PEN-Ph) combined with post self-crosslinking at high temperature. The film shows a 5% decomposition temperature over 520?°C and a glass transition temperature (Tg) around 386?°C. Stable dielectric constant and low dielectric loss are observed for this film in the frequency range of 100-200?kHz and in the temperature range of 25-300?°C. The temperature coefficient of dielectric constant is less than 0.001?°C-1 even at 400?°C. By cycling heating and cooling up to ten times or heating at 300?°C for 12?h, the film shows good reversibility and robustness of the dielectric properties. This crosslinked PEN film will be a potential candidate as high performance film capacitor electronic devices materials used at high temperature.

SUBMITTER: Yang R 

PROVIDER: S-EPMC5101497 | biostudies-literature | 2016 Nov

REPOSITORIES: biostudies-literature

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Crosslinked polyarylene ether nitrile film as flexible dielectric materials with ultrahigh thermal stability.

Yang Ruiqi R   Wei Renbo R   Li Kui K   Tong Lifen L   Jia Kun K   Liu Xiaobo X  

Scientific reports 20161109


Dielectric film with ultrahigh thermal stability based on crosslinked polyarylene ether nitrile is prepared and characterized. The film is obtained by solution-casting of polyarylene ether nitrile terminated phthalonitrile (PEN-Ph) combined with post self-crosslinking at high temperature. The film shows a 5% decomposition temperature over 520 °C and a glass transition temperature (T<sub>g</sub>) around 386 °C. Stable dielectric constant and low dielectric loss are observed for this film in the f  ...[more]

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