Ontology highlight
ABSTRACT:
SUBMITTER: Cheng G
PROVIDER: S-EPMC5622094 | biostudies-literature | 2017 Sep
REPOSITORIES: biostudies-literature
Cheng Gong G Li Heng H Xu Gaowei G Gai Wei W Luo Le L
Scientific reports 20170929 1
Nanotwinned copper (nt-Cu) shows a broad application prospects as interconnection materials in integrated circuit industry, since it combines the excellent mechanical and electrical properties. However, the formation and growth behavior of twin lamellae in pulse electrodeposited copper films are not fully understood. In this work, a series of electroplated copper films are prepared by verifying the electroplating parameters and the microstructures are analyzed using scanning electron microscope ...[more]