Browse
Submit Data
Databases
API
Help

Dataset Information

0 Views

0 Connections

0 Citations

0 Reanalyses

0 Downloads

Omics score: 0

Enhanced Thermal Conductivity of Polyimide Composites with Boron Nitride Nanosheets.

ABSTRACT: A strategy was reported to prepare boron nitride nanosheets (BNNSs) by a molten hydroxide assisted liquid exfoliation from hexagonal boron nitride (h-BN) powder. BNNSs with an average thickness of 3?nm were obtained by a facile, low-cost, and scalable exfoliation method. Highly thermally conductive polyimide (PI) composite films with BNNSs filler were prepared by solution-casting process. The in-plane thermal conductivity of PI composite films with 7?wt% BNNSs is up to 2.95?W/mK, which increased by 1,080% compared to the neat PI. In contrast, the out-of plane thermal conductivity of the composites is 0.44?W/mK, with an increase by only 76%. The high anisotropy of thermal conductivity was verified to be due to the high alignment of the BNNSs. The PI/BNNSs composite films are attractive for the thermal management applications in the field of next-generation electronic devices.

SUBMITTER: Wang T

PROVIDER: S-EPMC5784086 | biostudies-literature | 2018 Jan

REPOSITORIES: biostudies-literature

ACCESS DATA

Json Xml

Publications

Enhanced Thermal Conductivity of Polyimide Composites with Boron Nitride Nanosheets.

Wang Ting T Wang Mengjie M Fu Li L Duan Zehui Z Chen Yapeng Y Hou Xiao X Wu Yuming Y Li Shuangyi S Guo Liangchao L Kang Ruiyang R Jiang Nan N Yu Jinhong J

Scientific reports 20180124 1

A strategy was reported to prepare boron nitride nanosheets (BNNSs) by a molten hydroxide assisted liquid exfoliation from hexagonal boron nitride (h-BN) powder. BNNSs with an average thickness of 3 nm were obtained by a facile, low-cost, and scalable exfoliation method. Highly thermally conductive polyimide (PI) composite films with BNNSs filler were prepared by solution-casting process. The in-plane thermal conductivity of PI composite films with 7 wt% BNNSs is up to 2.95 W/mK, which increased ...[more]

PMID: 29367718

Similar Datasets

Simultaneously enhanced dielectric properties and through-plane thermal conductivity of epoxy composites with alumina and boron nitride nanosheets.

Project description:Dielectric materials with good thermal transport performance and desirable dielectric properties have significant potential to address the critical challenges of heat dissipation for microelectronic devices and power equipment under high electric field. This work reported the role of synergistic effect and interface on through-plane thermal conductivity and dielectric properties by intercalating the hybrid fillers of the alumina and boron nitride nanosheets (BNNs) into epoxy resin. For instance, epoxy composite with hybrid fillers at a relatively low loading shows an increase of around 3 times in through-plane thermal conductivity and maintains a close dielectric breakdown strength compared to pure epoxy. Meanwhile, the epoxy composite shows extremely low dielectric loss of 0.0024 at room temperature and 0.022 at 100 ℃ and 10-1 Hz. And covalent bonding and hydrogen-bond interaction models were presented for analyzing the thermal conductivity and dielectric properties.

| S-EPMC7844292 | biostudies-literature

Silver Nanoparticle-Deposited Boron Nitride Nanosheets as Fillers for Polymeric Composites with High Thermal Conductivity.

Project description:Polymer composites with high thermal conductivity have recently attracted much attention, along with the rapid development of the electronic devices toward higher speed and performance. However, a common method to enhance polymer thermal conductivity through an addition of high thermally conductive fillers usually cannot provide an expected value, especially for composites requiring electrical insulation. Here, we show that polymeric composites with silver nanoparticle-deposited boron nitride nanosheets as fillers could effectively enhance the thermal conductivity of polymer, thanks to the bridging connections of silver nanoparticles among boron nitride nanosheets. The thermal conductivity of the composite is significantly increased from 1.63 W/m-K for the composite filled with the silver nanoparticle-deposited boron nitride nanosheets to 3.06 W/m-K at the boron nitride nanosheets loading of 25.1 vol %. In addition, the electrically insulating properties of the composite are well preserved. Fitting the measured thermal conductivity of epoxy composite with one physical model indicates that the composite with silver nanoparticle-deposited boron nitride nanosheets outperforms the one with boron nitride nanosheets, owning to the lower thermal contact resistance among boron nitride nanosheets' interfaces. The finding sheds new light on enhancement of thermal conductivity of the polymeric composites which concurrently require the electrical insulation.

| S-EPMC4726004 | biostudies-literature

Enhanced Thermal Conductivity of Silicone Composites Filled with Few-Layered Hexagonal Boron Nitride.

Project description:In this study, we demonstrate the use of silicone/few-layered hexagonal boron nitride (FL-hBN) composites for heat dissipation applications. FL-hBN is synthesized via a green, facile, low-cost and scalable liquid exfoliation method using a jet cavitation process. The crystal structures, surface morphologies and specific surface areas of pristine h-BN and FL-hBN were characterized by XRD, SEM, TEM and AFM (atomic force microscopy). The results confirmed that FL-hBN with a thickness of ~4 nm was successfully obtained from the exfoliation process. In addition, we introduced both pristine h-BN and FL-hBN into silicone with different ratios to study their thermal properties. The results of the laser flash analysis indicate that the silicon/FL-hBN composite exhibited a higher thermal conductivity than that of the silicone/h-BN composite. With the optimal loading content of 30 wt.% FL-hBN content, the thermal conductivity of the composite could be enhanced to 230%, which is higher than that of silicone/h-BN (189%). These results indicate that jet cavitation is an effective and swift way to obtain few-layered hexagonal boron nitride that could effectively enhance the thermal conductivity of silicone composites.

| S-EPMC7570332 | biostudies-literature

Thermal Conductivity of Carbon/Boron Nitride Heteronanotube and Boron Nitride Nanotube Buckypapers: Implications for Thermal Management Composites.

Project description:To date, there has been limited reporting on the fabrication and properties of macroscopic sheet assemblies (specifically buckypapers) composed of carbon/boron nitride core-shell heteronanotubes (MWCNT@BNNT) or boron nitride nanotubes (BNNTs). Herein we report the synthesis of MWCNT@BNNTs via a facile method involving Atmospheric Pressure Chemical Vapor Deposition (APCVD) and the safe h-BN precursor ammonia borane. These MWCNT@BNNTs were used as sacrificial templates for BNNT synthesis by thermal oxidation of the core carbon. Buckypaper fabrication was facilitated by facile sonication and filtration steps. To test the thermal conductivity properties of these new buckypapers, in the interest of thermal management applications, we have developed a novel technique of advanced scanning thermal microscopy (SThM) that we call piercing SThM (pSThM). Our measurements show a 14% increase in thermal conductivity of the MWCNT@BNNT buckypaper relative to a control multiwalled carbon nanotube (MWCNT) buckypaper. Meanwhile, our BNNT buckypaper exhibited approximately half the thermal conductivity of the MWCNT control, which we attribute to the turbostratic quality of our BNNTs. To the best of our knowledge, this work achieves the first thermal conductivity measurement of a MWCNT@BNNT buckypaper and of a BNNT buckypaper composed of BNNTs not synthesized by high energy techniques.

| S-EPMC10496026 | biostudies-literature

Enhanced Thermal Conductivity of Epoxy Composites Filled with Al2O3/Boron Nitride Hybrids for Underfill Encapsulation Materials.

Project description:In this study, a thermal conductivity of 0.22 W·m-1·K-1 was obtained for pristine epoxy (EP), and the impact of a hybrid filler composed of two-dimensional (2D) flake-like boron nitride (BN) and zero-dimensional (0D) spherical micro-sized aluminum oxide (Al2O3) on the thermal conductivity of epoxy resin was investigated. With 80 wt.% hybrid Al2O3-BN filler contents, the thermal conductivity of the EP composite reached 1.72 W·m-1·K-1, increasing approximately 7.8-fold with respect to the pure epoxy matrix. Furthermore, different important properties for the application were analyzed, such as Fourier-transform infrared (FTIR) spectra, viscosity, morphology, coefficient of thermal expansion (CTE), glass transition temperature (Tg), decomposition temperature (Td), dielectric properties, and thermal infrared images. The obtained thermal performance is suitable for specific electronic applications such as flip-chip underfill packaging.

| S-EPMC7795928 | biostudies-literature

Thermal Conductivity and Cure Kinetics of Epoxy-Boron Nitride Composites-A Review.

Project description:Epoxy resin composites filled with thermally conductive but electrically insulating particles play an important role in the thermal management of modern electronic devices. Although many types of particles are used for this purpose, including oxides, carbides and nitrides, one of the most widely used fillers is boron nitride (BN). In this review we concentrate specifically on epoxy-BN composites for high thermal conductivity applications. First, the cure kinetics of epoxy composites in general, and of epoxy-BN composites in particular, are discussed separately in terms of the effects of the filler particles on cure parameters and the cured composite. Then, several fundamental aspects of epoxy-BN composites are discussed in terms of their effect on thermal conductivity. These aspects include the following: the filler content; the type of epoxy system used for the matrix; the morphology of the filler particles (platelets, agglomerates) and their size and concentration; the use of surface treatments of the filler particles or of coupling agents; and the composite preparation procedures, for example whether or not solvents are used for dispersion of the filler in the matrix. The dependence of thermal conductivity on filler content, obtained from over one hundred reports in the literature, is examined in detail, and an attempt is made to categorise the effects of the variables and to compare the results obtained by different procedures.

| S-EPMC7476057 | biostudies-literature

Thermal Conductivity Performance of Polypropylene Composites Filled with Polydopamine-Functionalized Hexagonal Boron Nitride.

Project description:Mussel-inspired approach was attempted to non-covalently functionalize the surfaces of boron nitride (BN) with self-polymerized dopamine coatings in order to reduce the interfacial thermal barrier and enhance the thermal conductivity of BN-containing composites. Compared to the polypropylene (PP) composites filled with pristine BN at the same filler content, thermal conductivity was much higher for those filled with both functionalized BN (f-BN) and maleic anhydride grafted PP (PP-g-ma) due to the improved filler dispersion and better interfacial filler-matrix compatibility, which facilitated the development of more thermal paths. Theoretical models were also applied to predict the composite thermal conductivity in which the Nielsen model was found to fit well with the experimental results, and the estimated effective aspect ratio of fillers well corresponded to the degree of filler aggregation as observed in the morphological study.

| S-EPMC5249180 | biostudies-literature

The use of polyimide-modified aluminum nitride fillers in AlN@PI/epoxy composites with enhanced thermal conductivity for electronic encapsulation.

Project description:Polymer modified fillers in composites has attracted the attention of numerous researchers. These fillers are composed of core-shell structures that exhibit enhanced physical and chemical properties that are associated with shell surface control and encapsulated core materials. In this study, we have described an apt method to prepare polyimide (PI)-modified aluminum nitride (AlN) fillers, AlN@PI. These fillers are used for electronic encapsulation in high performance polymer composites. Compared with that of untreated AlN composite, these AlN@PI/epoxy composites exhibit better thermal and dielectric properties. At 40 wt% of filler loading, the highest thermal conductivity of AlN@PI/epoxy composite reached 2.03 W/mK. In this way, the thermal conductivity is approximately enhanced by 10.6 times than that of the used epoxy matrix. The experimental results exhibiting the thermal conductivity of AlN@PI/epoxy composites were in good agreement with the values calculated from the parallel conduction model. This research work describes an effective pathway that modifies the surface of fillers with polymer coating. Furthermore, this novel technique improves the thermal and dielectric properties of fillers and these can be used extensively for electronic packaging applications.

| S-EPMC3998031 | biostudies-literature

Vertically Aligned Silicon Carbide Nanowires/Boron Nitride Cellulose Aerogel Networks Enhanced Thermal Conductivity and Electromagnetic Absorbing of Epoxy Composites.

Project description:With the innovation of microelectronics technology, the heat dissipation problem inside the device will face a severe test. In this work, cellulose aerogel (CA) with highly enhanced thermal conductivity (TC) in vertical planes was successfully obtained by constructing a vertically aligned silicon carbide nanowires (SiC NWs)/boron nitride (BN) network via the ice template-assisted strategy. The unique network structure of SiC NWs connected to BN ensures that the TC of the composite in the vertical direction reaches 2.21 W m-1 K-1 at a low hybrid filler loading of 16.69 wt%, which was increased by 890% compared to pure epoxy (EP). In addition, relying on unique porous network structure of CA, EP-based composite also showed higher TC than other comparative samples in the horizontal direction. Meanwhile, the composite exhibits good electrically insulating with a volume electrical resistivity about 2.35 × 1011 Ω cm and displays excellent electromagnetic wave absorption performance with a minimum reflection loss of - 21.5 dB and a wide effective absorption bandwidth (< - 10 dB) from 8.8 to 11.6 GHz. Therefore, this work provides a new strategy for manufacturing polymer-based composites with excellent multifunctional performances in microelectronic packaging applications.

| S-EPMC9056589 | biostudies-literature

Low thermal contact resistance boron nitride nanosheets composites enabled by interfacial arc-like phonon bridge.

Project description:Two-dimensional materials with ultrahigh in-plane thermal conductivity are ideal for heat spreader applications but cause significant thermal contact resistance in complex interfaces, limiting their use as thermal interface materials. In this study, we present an interfacial phonon bridge strategy to reduce the thermal contact resistance of boron nitride nanosheets-based composites. By using a low-molecular-weight polymer, we are able to manipulate the alignment of boron nitride nanosheets through sequential stacking and cutting, ultimately achieving flexible thin films with a layer of arc-like structure superimposed on perpendicularly aligned ones. Our results suggest that arc-like structure can act as a phonon bridge to lower the contact resistance by 70% through reducing phonon back-reflection and enhancing phonon coupling efficiency at the boundary. The resulting composites exhibit ultralow thermal contact resistance of 0.059 in2 KW-1, demonstrating effective cooling of fast-charging batteries at a thickness 2-5 times thinner than commercial products.

| S-EPMC10994942 | biostudies-literature

OmicsDI is part of the ELIXIR infrastructure

OmicsDI is an Elixir interoperability service. Learn more ›

Tweets

OmicsDI Databases

PRIDE
PeptideAtlas
MassIVE
JPOST Repository
Physiome Model Repository

EGA
EVA
ENA
LINCS
PAXDB
Cell Collective

MetaboLights
Metabolomics Workbench
MetabolomeExpress
GNPS
BioModels
FAIRDOMHub

ArrayExpress
dbGaP
ExpressionAtlas
GEO
NODE

Information

Databases
Help
API
Contact us
Code on GitHub
Terms of use
Submit Data