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Flash-Induced Stretchable Cu Conductor via Multiscale-Interfacial Couplings.


ABSTRACT: Herein, a novel stretchable Cu conductor with excellent conductivity and stretchability is reported via the flash-induced multiscale tuning of Cu and an elastomer interface. Microscale randomly wrinkled Cu (amplitude of ?5?µm and wavelength of ?45 µm) is formed on a polymer substrate through a single pulse of a millisecond flash light, enabling the elongation of Cu to exceed 20% regardless of the stretching direction. The nanoscale interlocked interface between the Cu nanoparticles (NPs) and the elastomer increases the adhesion force of Cu, which contributes to a significant improvement of the Cu stability and stretchability under harsh yielding stress. Simultaneously, the flash-induced photoreduction of CuO NPs and subsequent Cu NP welding lead to outstanding conductivity (?37 kS cm-1) of the buckled elastic electrode. The 3D structure of randomly wrinkled Cu is modeled by finite element analysis simulations to show that the flash-activated stretchable Cu conductors can endure strain over 20% in all directions. Finally, the wrinkled Cu is utilized for wireless near-field communication on the skin of human wrist.

SUBMITTER: Park JH 

PROVIDER: S-EPMC6247032 | biostudies-literature | 2018 Nov

REPOSITORIES: biostudies-literature

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Flash-Induced Stretchable Cu Conductor via Multiscale-Interfacial Couplings.

Park Jung Hwan JH   Seo Jeongmin J   Kim Cheolgyu C   Joe Daniel J DJ   Lee Han Eol HE   Im Tae Hong TH   Seok Jae Young JY   Jeong Chang Kyu CK   Ma Boo Soo BS   Park Hyung Kun HK   Kim Taek-Soo TS   Lee Keon Jae KJ  

Advanced science (Weinheim, Baden-Wurttemberg, Germany) 20181004 11


Herein, a novel stretchable Cu conductor with excellent conductivity and stretchability is reported via the flash-induced multiscale tuning of Cu and an elastomer interface. Microscale randomly wrinkled Cu (amplitude of ≈5 µm and wavelength of ≈45 µm) is formed on a polymer substrate through a single pulse of a millisecond flash light, enabling the elongation of Cu to exceed 20% regardless of the stretching direction. The nanoscale interlocked interface between the Cu nanoparticles (NPs) and the  ...[more]

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