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Characteristics of microcontact printing with polyelectrolyte ink for the precise preparation of patches on silica particles.

ABSTRACT: This publication demonstrates the abilities of a precise and straightforward microcontact printing approach for the preparation of patchy silica particles. In a broad particle size range, it is possible to finely tune the number and parameters of three-dimensional patches like diameter and thickness using only polyethyleneimine ink, poly(dimethoxysilane) as stamp material and a suitable release solvent.

SUBMITTER: Zimmermann M

PROVIDER: S-EPMC6333231 | biostudies-literature | 2018 Nov

REPOSITORIES: biostudies-literature

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Characteristics of microcontact printing with polyelectrolyte ink for the precise preparation of patches on silica particles.

Zimmermann Marc M Grigoriev Dmitry D Puretskiy Nikolay N Böker Alexander A

RSC advances 20181123 69

This publication demonstrates the abilities of a precise and straightforward microcontact printing approach for the preparation of patchy silica particles. In a broad particle size range, it is possible to finely tune the number and parameters of three-dimensional patches like diameter and thickness using only polyethyleneimine ink, poly(dimethoxysilane) as stamp material and a suitable release solvent. ...[more]

PMID: 30713686

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From 2D to 3D patches on multifunctional particles: how microcontact printing creates a new dimension of functionality.

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Facile Preparation of Monodisperse Cu@Ag Core-Shell Nanoparticles for Conductive Ink in Printing Electronics.

Project description:Copper-based nanoinks are emerging as promising low-cost alternatives to widely used silver nanoinks in electronic printing. However, the spontaneous oxidation of copper under ambient conditions poses significant challenges to its broader application. To address this issue, this paper presents an economical, large-scale, and environmentally friendly method for fabricating Cu@Ag nanoparticles (Cu@Ag NPs). The as-prepared nanoparticles exhibit a narrow size distribution of approximately 100 nm and can withstand ambient exposure for at least 60 days without significant oxidation. The Cu@Ag-based ink, with a 60 wt% loading, was screen-printed onto a flexible polyimide substrate and subsequently heat-treated at 290 °C for 15 minutes under a nitrogen atmosphere. The sintered pattern displayed a low electrical resistivity of 25.5 μΩ·cm (approximately 15 times the resistivity of bulk copper) along with excellent reliability and mechanical fatigue strength. The innovative Cu@Ag NPs fabrication method holds considerable potential for advancing large-scale applications of copper-based inks in flexible electronics.

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