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Electrically Robust Single-Crystalline WTe2 Nanobelts for Nanoscale Electrical Interconnects.


ABSTRACT: As the elements of integrated circuits are downsized to the nanoscale, the current Cu-based interconnects are facing limitations due to increased resistivity and decreased current-carrying capacity because of scaling. Here, the bottom-up synthesis of single-crystalline WTe2 nanobelts and low- and high-field electrical characterization of nanoscale interconnect test structures in various ambient conditions are reported. Unlike exfoliated flakes obtained by the top-down approach, the bottom-up growth mode of WTe2 nanobelts allows systemic characterization of the electrical properties of WTe2 single crystals as a function of channel dimensions. Using a 1D heat transport model and a power law, it is determined that the breakdown of WTe2 devices under vacuum and with AlO x capping layer follows an ideal pattern for Joule heating, far from edge scattering. High-field electrical measurements and self-heating modeling demonstrate that the WTe2 nanobelts have a breakdown current density approaching ?100 MA cm-2, remarkably higher than those of conventional metals and other transition-metal chalcogenides, and sustain the highest electrical power per channel length (?16.4 W cm-1) among the interconnect candidates. The results suggest superior robustness of WTe2 against high-bias sweep and its possible applicability in future nanoelectronics.

SUBMITTER: Song S 

PROVIDER: S-EPMC6364501 | biostudies-literature | 2019 Feb

REPOSITORIES: biostudies-literature

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Electrically Robust Single-Crystalline WTe<sub>2</sub> Nanobelts for Nanoscale Electrical Interconnects.

Song Seunguk S   Kim Se-Yang SY   Kwak Jinsung J   Jo Yongsu Y   Kim Jung Hwa JH   Lee Jong Hwa JH   Lee Jae-Ung JU   Kim Jong Uk JU   Yun Hyung Duk HD   Sim Yeoseon Y   Wang Jaewon J   Lee Do Hee DH   Seok Shi-Hyun SH   Kim Tae-Il TI   Cheong Hyeonsik H   Lee Zonghoon Z   Kwon Soon-Yong SY  

Advanced science (Weinheim, Baden-Wurttemberg, Germany) 20181212 3


As the elements of integrated circuits are downsized to the nanoscale, the current Cu-based interconnects are facing limitations due to increased resistivity and decreased current-carrying capacity because of scaling. Here, the bottom-up synthesis of single-crystalline WTe<sub>2</sub> nanobelts and low- and high-field electrical characterization of nanoscale interconnect test structures in various ambient conditions are reported. Unlike exfoliated flakes obtained by the top-down approach, the bo  ...[more]

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