Dataset Information

A low-cost concurrent TSV test architecture with lossless test output compression scheme.

ABSTRACT: As the traditional IC design migrates to three-dimensional integrated circuits (3D-ICs) design, new challenges need to be considered carefully to solve its reliability and yield issues. 3D-ICs using through-silicon-vias (TSVs) can have latent defects such as resistive open and bridge defects, which are caused by the thermal stress during the fabrication process. These latent defects lead to the deterioration of the electrical performance of TSVs caused by an undesired increase in the resistance-capacitance (RC) delay. For this reason, various post-bond test methodologies have been studied to improve the reliability of 3D-ICs. Cost reduction in these TSV test architectures is also currently being studied by decreasing various factors such as hardware overhead, test time, and the peak current consumption. Usually, a single test-clock-period is required to determine whether the test result contains the defective TSV. When the test result of any TSVs fails, we use another single test-clock-period to classify its defect type. In this paper, we propose a new TSV test architecture to transfer the combined test output of the test result and the specific defect type to the pad during the single test-clock-period. Our proposed test architecture also provides a reliable block-based concurrent testing to optimize the test time by dividing the die into concurrent blocks. The experimental results showed that our proposed test architecture could reduce the test time and the hardware overhead substantially by ensuring that the reasonable peak power consumption for mass production was reasonable without the test quality being adversely affected.

SUBMITTER: Lee YW

PROVIDER: S-EPMC6707603 | biostudies-literature | 2019

REPOSITORIES: biostudies-literature

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A low-cost concurrent TSV test architecture with lossless test output compression scheme.

Lee Young-Woo YW Lim Hyunchan H Seo Sungyoul S Cho Keewon K Kang Sungho S

PloS one 20190823 8

As the traditional IC design migrates to three-dimensional integrated circuits (3D-ICs) design, new challenges need to be considered carefully to solve its reliability and yield issues. 3D-ICs using through-silicon-vias (TSVs) can have latent defects such as resistive open and bridge defects, which are caused by the thermal stress during the fabrication process. These latent defects lead to the deterioration of the electrical performance of TSVs caused by an undesired increase in the resistance- ...[more]

PMID: 31442246

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Project description:BACKGROUND:This study describes a low-cost and time-efficient clinical sensory test (CST) battery and evaluates its concurrent validity as a screening tool to detect somatosensory dysfunction as determined using quantitative sensory testing (QST). METHOD:Three patient cohorts with carpal tunnel syndrome (CTS, n = 76), non-specific neck and arm pain (NSNAP, n = 40) and lumbar radicular pain/radiculopathy (LR, n = 26) were included. The CST consisted of 13 tests, each corresponding to a QST parameter and evaluating a broad spectrum of sensory functions using thermal (coins, ice cube, hot test tube) and mechanical (cotton wool, von Frey hairs, tuning fork, toothpicks, thumb and eraser pressure) detection and pain thresholds testing both loss and gain of function. Agreement rate, statistical significance and strength of correlation (phi coefficient) between CST and QST parameters were calculated. RESULTS:Several CST parameters (cold, warm and mechanical detection thresholds as well as cold and pressure pain thresholds) were significantly correlated with QST, with a majority demonstrating >60% agreement rates and moderate to relatively strong correlations. However, agreement varied among cohorts. Gain of function parameters showed stronger agreement in the CTS and LR cohorts, whereas loss of function parameters had better agreement in the NSNAP cohort. Other CST parameters (16 mN von Frey tests, vibration detection, heat and mechanical pain thresholds, wind-up ratio) did not significantly correlate with QST. CONCLUSION:Some of the tests in the CST could help detect somatosensory dysfunction as determined with QST. Parts of the CST could therefore be used as a low-cost screening tool in a clinical setting. SIGNIFICANCE:Quantitative sensory testing, albeit considered the gold standard to evaluate somatosensory dysfunction, requires expensive equipment, specialized examiner training and substantial time commitment which challenges its use in a clinical setting. Our study describes a CST as a low-cost and time-efficient alternative. Some of the CST tools (cold, warm, mechanical detection thresholds; pressure pain thresholds) significantly correlated with the respective QST parameters, suggesting that they may be useful in a clinical setting to detect sensory dysfunction.

Project description:BACKGROUND:Advanced sequencing machines dramatically speed up the generation of genomic data, which makes the demand of efficient compression of sequencing data extremely urgent and significant. As the most difficult part of the standard sequencing data format FASTQ, compression of the quality score has become a conundrum in the development of FASTQ compression. Existing lossless compressors of quality scores mainly utilize specific patterns generated by specific sequencer and complex context modeling techniques to solve the problem of low compression ratio. However, the main drawbacks of these compressors are the problem of weak robustness which means unstable or even unavailable results of sequencing files and the problem of slow compression speed. Meanwhile, some compressors attempt to construct a fine-grained index structure to solve the problem of slow random access decompression speed. However, they solve the problem at the sacrifice of compression speed and at the expense of large index files, which makes them inefficient and impractical. Therefore, an efficient lossless compressor of quality scores with strong robustness, high compression ratio, fast compression and random access decompression speed is urgently needed and of great significance. RESULTS:In this paper, based on the idea of maximizing the use of hardware resources, LCQS, a lossless compression tool specialized for quality scores, was proposed. It consists of four sequential processing steps: partitioning, indexing, packing and parallelizing. Experimental results reveal that LCQS outperforms all the other state-of-the-art compressors on all criteria except for the compression speed on the dataset SRR1284073. Furthermore, LCQS presents strong robustness on all the test datasets, with its acceleration ratios of compression speed increasing by up to 29.1x, its file size reducing by up to 28.78%, and its random access decompression speed increasing by up to 2.1x. Additionally, LCQS also exhibits strong scalability. That is, the compression speed increases almost linearly as the size of input dataset increases. CONCLUSION:The ability to handle all different kinds of quality scores and superiority in compression ratio and compression speed make LCQS a high-efficient and advanced lossless quality score compressor, along with its strength of fast random access decompression. Our tool LCQS can be downloaded from https://github.com/SCUT-CCNL/LCQSand freely available for non-commercial usage.

Dataset Information

A low-cost concurrent TSV test architecture with lossless test output compression scheme.

Publications

A low-cost concurrent TSV test architecture with lossless test output compression scheme.

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