Dataset Information

Structural Design of Three-Dimensional Graphene/Nano Filler (Al2O3, BN, or TiO2) Resins and Their Application to Electrically Conductive Adhesives.

ABSTRACT: In this study, we designed a three-dimensional structure of electrically conductive adhesives (ECAs) by adding three different kinds of nano filler, including BN, TiO2, and Al2O3 particles, into a few-layered graphene (FLG)/polymer composite to avoid FLG aggregation. Three different lateral sizes of FLG (FLG3, FLG8, and FLG20) were obtained from graphite (G3, G8, and G20) by a green, facile, low-cost, and scalable jet cavitation process. The corresponding characterizations, such as Raman spectroscopy, scanning electron microscopy (SEM), atomic force microscopy (AFM), and transmission electron microscopy (TEM), verified the successful preparation of graphene flakes. Based on the results of four-point probe measurements, FLG20 demonstrated the lowest sheet resistance value of ~0.021 ?/?. The optimized ECAs' composition was a 60% solid content of FLG20 with the addition 2 wt.% of Al2O3. The sheet resistance value was as low as 51.8 ?/?, which was a reduction of 73% compared to that of pristine FLG/polymer. These results indicate that this method not only paves the way for the cheaper and safer production of graphene, but also holds great potential for applications in energy-related technologies.

SUBMITTER: Zhang CH

PROVIDER: S-EPMC6835405 | biostudies-literature | 2019 Oct

REPOSITORIES: biostudies-literature

ACCESS DATA

Publications

Structural Design of Three-Dimensional Graphene/Nano Filler (Al2O3, BN, or TiO2) Resins and Their Application to Electrically Conductive Adhesives.

Zhang Chia-Hsin CH Huang Chia-Hung CH Liu Wei-Ren WR

Polymers 20191018 10

In this study, we designed a three-dimensional structure of electrically conductive adhesives (ECAs) by adding three different kinds of nano filler, including BN, TiO2, and Al2O3 particles, into a few-layered graphene (FLG)/polymer composite to avoid FLG aggregation. Three different lateral sizes of FLG (FLG3, FLG8, and FLG20) were obtained from graphite (G3, G8, and G20) by a green, facile, low-cost, and scalable jet cavitation process. The corresponding charact ...[more]

PMID: 31635315

Similar Datasets

Project description:Printing of electrical circuits and interconnects using isotropic conductive adhesives (ICAs) is of great interest due to their low-temperature processing and compatibility with substrates for applications in sensors, healthcare, and flexible devices. As a lower cost alternative to silver (Ag), copper (Cu)-filled ICAs are desirable but limited by the formation of high-resistivity Cu surface oxides. To overcome this limitation, self-assembled monolayers (SAMs) of octadecanethiol (ODT) have been demonstrated to reduce the oxidation of micrometer-scale Cu powder particles for use in ICAs. However, the deposition and function of the SAM require further investigation, as described in this paper. As part of this work, the stages of the SAM deposition process, which included etching with hydrochloric acid to remove pre-existing oxides, were studied using X-ray photoelectron spectroscopy (XPS), which showed low levels of subsequent Cu oxidation when ODT coated. The treated Cu powders were combined with one- or two-part epoxy resins to make Cu-ICAs, and the effect of the Cu surface condition and weight loading on electrical conductivity was examined. When thermally cured in an inert argon atmosphere, ICAs filled with Cu protected by ODT achieved electrical conductivity up to 20 × 105 S·m-1, comparable to Ag-ICAs, and were used to make a functional circuit. To understand the function of the SAM in these Cu-ICAs, scanning and transmission electron microscopy were used to examine the internal micro- and nano-structures along with the elemental distribution at the interfaces within sections taken from cured samples. Sulfur (S), indicative of the ODT, was still detected at the internal polymer-metal interface after curing, and particle-to-particle contacts were also examined. XPS also identified S on the surface of cured Cu-ICAs even after thermal treatment. Based on the observations, electrical contact and conduction mechanisms for these Cu-filled ICAs are proposed and discussed.

Dataset Information

Structural Design of Three-Dimensional Graphene/Nano Filler (Al2O3, BN, or TiO2) Resins and Their Application to Electrically Conductive Adhesives.

Publications

Structural Design of Three-Dimensional Graphene/Nano Filler (Al<sub>2</sub>O<sub>3</sub>, BN, or TiO<sub>2</sub>) Resins and Their Application to Electrically Conductive Adhesives.

Similar Datasets

OmicsDI is part of the ELIXIR infrastructure

Tweets