Unknown

Dataset Information

0

Dimensional hierarchy of higher-order topology in three-dimensional sonic crystals.


ABSTRACT: Wave trapping and manipulation are at the heart of modern integrated photonics and acoustics. Grand challenges emerge on increasing the integration density and reducing the wave leakage/noises due to fabrication imperfections, especially for waveguides and cavities at subwavelength scales. The rising of robust wave dynamics based on topological mechanisms offers possible solutions. Ideally, in a three-dimensional (3D) topological integrated chip, there are coexisting robust two-dimensional (2D) interfaces, one-dimensional (1D) waveguides and zero-dimensional (0D) cavities. Here, we report the experimental discovery of such a dimensional hierarchy of the topologically-protected 2D surface states, 1D hinge states and 0D corner states in a single 3D system. Such an unprecedented phenomenon is triggered by the higher-order topology in simple-cubic sonic crystals and protected by the space group [Formula: see text]. Our study opens up a new regime for multidimensional wave trapping and manipulation at subwavelength scales, which may inspire future technology for integrated acoustics and photonics.

SUBMITTER: Zhang X 

PROVIDER: S-EPMC6877633 | biostudies-literature | 2019 Nov

REPOSITORIES: biostudies-literature

altmetric image

Publications

Dimensional hierarchy of higher-order topology in three-dimensional sonic crystals.

Zhang Xiujuan X   Xie Bi-Ye BY   Wang Hong-Fei HF   Xu Xiangyuan X   Tian Yuan Y   Jiang Jian-Hua JH   Lu Ming-Hui MH   Chen Yan-Feng YF  

Nature communications 20191125 1


Wave trapping and manipulation are at the heart of modern integrated photonics and acoustics. Grand challenges emerge on increasing the integration density and reducing the wave leakage/noises due to fabrication imperfections, especially for waveguides and cavities at subwavelength scales. The rising of robust wave dynamics based on topological mechanisms offers possible solutions. Ideally, in a three-dimensional (3D) topological integrated chip, there are coexisting robust two-dimensional (2D)  ...[more]

Similar Datasets

| S-EPMC6195185 | biostudies-literature
| S-EPMC7755923 | biostudies-literature
| S-EPMC9450183 | biostudies-literature
| S-EPMC7101231 | biostudies-literature
| S-EPMC8748824 | biostudies-literature
| S-EPMC7080542 | biostudies-literature
| S-EPMC7994416 | biostudies-literature
| S-EPMC6453538 | biostudies-literature
| S-EPMC8100142 | biostudies-literature
| S-EPMC7064592 | biostudies-literature