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Design of a Tribotester Based on Non-Contact Displacement Measurements.

ABSTRACT: A tribotester with an integrated load sensor based on a strain gauge is typically used to measure the friction coefficient generated by the contact-related sliding motion of two objects. Since the friction coefficient is obtained by dividing the measured friction force by the applied normal force, the normal and friction forces must be measured for accurate analysis. In this study, a tribotester was used to measure the displacement of a cantilever tip using the fiberoptic sensor in a non-contact method. The friction coefficient measurement using the fiberoptic sensor was proven to be valid by calibrating the tip displacement due to normal/friction forces after designing a basic structural cantilever tip based on experiments and simulation analyses. The results obtained by using the fiberoptic sensor-cantilever tip-based tribotester were compared with those obtained using commercial and/or custom-built tribotesters under the same conditions. By designing various shapes of cantilever tips and using simulation analysis, the calibrations of the normal/friction forces and tip displacement could be verified and the coupling effect was evaluated. The performance and reliability of the fiberoptic sensor-cantilever tip-based tribotester, which can be used to determine the normal/friction forces by non-contact displacement measurements without a strain gauge, were verified.

SUBMITTER: Kim CL

PROVIDER: S-EPMC6915551 | biostudies-literature | 2019 Oct

REPOSITORIES: biostudies-literature

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Design of a Tribotester Based on Non-Contact Displacement Measurements.

Kim Chang-Lae CL Sung Yoon-Gyung YG

Micromachines 20191031 11

A tribotester with an integrated load sensor based on a strain gauge is typically used to measure the friction coefficient generated by the contact-related sliding motion of two objects. Since the friction coefficient is obtained by dividing the measured friction force by the applied normal force, the normal and friction forces must be measured for accurate analysis. In this study, a tribotester was used to measure the displacement of a cantilever tip using the fiberoptic sensor in a non-contact ...[more]

PMID: 31683721

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Project description:Thermal conductivity measurements using Scanning Thermal Microscopy (SThM) usually involve heat transfer across the mechanical contact and liquid meniscus between the thermal probe and the sample. However, variations in contact conditions due to capillary effects at probe-sample contact and probe and sample wear due to mechanical contact interfere with accurate determination of the thermal conductivity. This paper presents measurements of thin film thermal conductivity using a SThM method employing a Wollaston probe in non-contact mode in synergy with detailed heat transfer analysis. In this technique, the thermal probe is scanned above the sample at a distance comparable with the mean free path of the ambient gas molecules. A Three-Dimensional Finite Element Model (3DFEM) that includes the specifics of the heat transfer between the sample and the probe in transition heat conduction regime was developed to predict the SThM probe thermal resistance and fit the thermal conductivity of the measured thin films. Proof-of-concept experimental in-plane thermal conductivity results for 240 nm and 46.6 nm Au films deposited on glass and silicon substrates were validated by experimental measurements of their electrical conductivity coupled with the Wiedemann-Franz law, with a discrepancy < 6.4%. Moreover, predictions based on a kinetic theory model for thin-film thermal conductivity agreed with the experimental results for the Au films with <6.6% discrepancy. To reduce the time and complexity of data analysis and facilitate experimental planning, an analytical model was also developed for the thermal transport between the Wollaston probe, ambient, and film-on-substrate samples. The accuracy of thin film thermal conductivity measurements using the analytical model was investigated using 3DFEM simulations. Fitted functions were developed for fast data analysis of thermal conductivity of thin films in the range of ∼100-600 W m-1 K-1 and thickness between ∼50-300 nm deposited on the two types of substrates investigated in this work, which yielded results with a discrepancy of 6-16.7% when compared to the Au films' thermal conductivity values.

Dataset Information

Design of a Tribotester Based on Non-Contact Displacement Measurements.

Publications

Design of a Tribotester Based on Non-Contact Displacement Measurements.

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