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High-performance ceramic/epoxy composite adhesives enabled by rational ceramic bandgaps.

ABSTRACT: High over-all properties, including low dielectric loss, high breakdown strength, high mechanical shock strength, high thermal conductivity and high weight stability, are very difficult to simultaneously achieve in electrical-insulation applicable cured potting-adhesive materials. To deal with this challenge, in this work, we have designed and fabricated a series of epoxy based composite potting-adhesives filled with low-cost and high-performance inorganic micro-particles including alpha-silica, alpha-alumina and alpha-SiC. Combination employment of high-molecular-weight and low-molecular-weight epoxy resins as matrices has been made. Heat-induced curing or crosslink of resin matrices has been carried out. Large band gap of silica filler has endowed the cured composite with high breakdown strength and ageing breakdown strength, and meanwhile relatively high deformation trait of silica has led to high shock strength of cured composite. Silica filler has been found to be superior to other two fillers, namely, optimal over-all properties such as dielectric, breakdown, mechanical and thermal features have been obtained in silica filled cured composite. High breakdown strength of ~48?MV m-1 and shock strength of ~9950?J?m-2 have been achieved in silica loaded composite. This work might open up the way for large-scale fabrication of promising epoxy-based hybrid potting-adhesives.

SUBMITTER: Hu JB

PROVIDER: S-EPMC6965657 | biostudies-literature | 2020 Jan

REPOSITORIES: biostudies-literature

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High-performance ceramic/epoxy composite adhesives enabled by rational ceramic bandgaps.

Hu J B JB

Scientific reports 20200116 1

High over-all properties, including low dielectric loss, high breakdown strength, high mechanical shock strength, high thermal conductivity and high weight stability, are very difficult to simultaneously achieve in electrical-insulation applicable cured potting-adhesive materials. To deal with this challenge, in this work, we have designed and fabricated a series of epoxy based composite potting-adhesives filled with low-cost and high-performance inorganic micro-particles including alpha-silica, ...[more]

PMID: 31949169

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Project description:Dental adhesives are vital for the success of dental restorations. The objective of this study is to make strong and durable dental adhesives that are free from 2 symbolic methacrylate-based dental resins-2-bis[4-(2-hydroxy-3-methacryl-oxypropoxy)-phenyl]-propane (Bis-GMA) and 2-hydroxyethyl-methacrylate (HEMA)-and have equivalent/improved bonding strength and durability. We formulated, prepared, and evaluated 2 dental adhesives using mixtures of a hydrolytically stable ether-based monomer, triethylene glycol divinylbenzyl ether (TEG-DVBE), with urethane dimethacrylate (UDMA) or pyromellitic glycerol dimethacrylate. These adhesives were composed of equimolar ester-/ether-based vinyl functional groups. They were compared with Bis-GMA/HEMA-based commercial and experimental dental adhesives in terms of shear bond strength and microtensile bond strength (µTBS) to human dentin and the µTBS bond stability under extended thermocycling challenges. In addition, the resins' infiltration to dentin tubules, mechanical performance, and chemical properties were assessed by scanning electron microscopy, ISO standard flexural strength and modulus measurements, contact angle measurements, and water sorption/solubility measurements. The hybrid TEG-DVBE-containing dental adhesives generated equivalent shear bond strength and µTBS in comparison with the controls. Significantly, these adhesives outperformed the controls after being challenged by 10,000 thermocycles between 5 °C and 55 °C. Water contact angle measurements suggested that the hybrid dental adhesives were relatively more hydrophobic than the Bis-GMA/HEMA controls. However, both TEG-DVBE-containing adhesives developed more and deeper resin tags in dentin tubules and formed thicker hybrid layers at the composite-dentin interface. Furthermore, the water solubility of UDMA/TEG-DVBE resins was reduced approximately 89% in comparison with the Bis-GMA/HEMA controls. The relatively hydrophobic adhesives that achieved equivalent/enhanced bonding performance suggest great potentials in developing dental restoration with extended service life. Furthermore, the TEG-DVBE-containing materials may find wider dental applications and broader utility in medical device development.

Dataset Information

High-performance ceramic/epoxy composite adhesives enabled by rational ceramic bandgaps.

Publications

High-performance ceramic/epoxy composite adhesives enabled by rational ceramic bandgaps.

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