Ontology highlight
ABSTRACT:
SUBMITTER: Mansour Rezaei Fumani N
PROVIDER: S-EPMC7143401 | biostudies-literature | 2020 Apr
REPOSITORIES: biostudies-literature
Environmental science & technology 20141030 22
This work measured and compared the effluent from the chemical mechanical polishing (CMP) of silicon dioxide using ceria slurry and ceria fixed abrasive. CMP waste streams were tested for total solids, cerium, silicon, and 6 nm to 20 μm diameter particles. The concentration of cerium and total solids in the effluent were very different for the two polishes studied. The fixed abrasive polish produced 94% less CeO2 emissions per SiO2 removed. The higher ceria levels in the slurry effluent are asso ...[more]