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A Direct Epitaxial Approach To Achieving Ultrasmall and Ultrabright InGaN Micro Light-Emitting Diodes (?LEDs).


ABSTRACT: A direct epitaxial approach to achieving ultrasmall and ultrabright InGaN micro light-emitting diodes (?LEDs) has been developed, leading to the demonstration of ultrasmall, ultraefficient, and ultracompact green ?LEDs with a dimension of 3.6 ?m and an interpitch of 2 ?m. The approach does not involve any dry-etching processes which are exclusively used by any current ?LED fabrication approaches. As a result, our approach has entirely eliminated any damage induced during the dry-etching processes. Our green ?LED array chips exhibit a record external quantum efficiency (EQE) of 6% at ?515 nm in the green spectral region, although our measurements have been performed on bare chips which do not have any coating, passivation, epoxy, or reflector, which are generally used for standard LED packaging in order to enhance extraction efficiency. A high luminance of >107 cd/m2 has been obtained on the ?LED array bare chips. Temperature-dependent measurements show that our ?LED array structure exhibits an internal quantum efficiency (IQE) of 28%. It is worth highlighting that our epitaxial approach is fully compatible with any existing microdisplay fabrication techniques.

SUBMITTER: Bai J 

PROVIDER: S-EPMC7147254 | biostudies-literature | 2020 Feb

REPOSITORIES: biostudies-literature

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A Direct Epitaxial Approach To Achieving Ultrasmall and Ultrabright InGaN Micro Light-Emitting Diodes (μLEDs).

Bai Jie J   Cai Yuefei Y   Feng Peng P   Fletcher Peter P   Zhao Xuanming X   Zhu Chenqi C   Wang Tao T  

ACS photonics 20200110 2


A direct epitaxial approach to achieving ultrasmall and ultrabright InGaN micro light-emitting diodes (μLEDs) has been developed, leading to the demonstration of <i>ultrasmall, ultraefficient, and ultracompact green μLEDs with a dimension of 3.6 μm and an interpitch of 2 μm</i>. The approach does not involve any dry-etching processes which are exclusively used by any current μLED fabrication approaches. As a result, our approach has entirely eliminated any damage induced during the dry-etching p  ...[more]

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