Improving the thermal conductivity of epoxy composites using a combustion-synthesized aggregated ?-Si₃N₄ filler with randomly oriented grains.

ABSTRACT: Electrically insulating and thermally conductive polymer matrix composites are desirable for industry applications as they improve the reliability of high-performance electronic devices, particularly via heat dissipation in devices loaded with several electronic components. In this study, an aggregated ?-Si₃N₄ filler with randomly oriented grains was produced via combustion synthesis to improve the thermal conductivity of epoxy composites. The thermal conductivities of the prepared composites were investigated as a function of the filler content, and the values were compared to those of composites loaded with commercial ?-Si₃N₄ (non-aggregated)_. Negligible difference was observed in the thermal conductivities of both types of composites when the Si₃N₄ content was below 40 vol%; however, above 40 vol%, the aggregated ?-Si₃N₄ filler-loaded composites showed higher thermal conductivities than the commercial ?-Si₃N₄-loaded composites. The aggregated ?-Si₃N₄ filler-loaded composites exhibited isotropic thermal conductivities with a maximum value of 4.7 W m^-1 K^-1 at 53 vol% filler content, which is approximately 2.4 times higher than that of the commercial ?-Si₃N₄-loaded composites, thereby suggesting that the morphology of the aggregated filler would be more efficient than that of the commonly used non-aggregated filler in enhancing the thermal conductivity of a polymer matrix composite.

SUBMITTER: Shimamura A 

PROVIDER: S-EPMC7483705 | biostudies-literature | 2020 Sep

REPOSITORIES: biostudies-literature