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Simple Method for Efficient Slot-Die Coating of MAPbI3 Perovskite Thin Films in Ambient Air Conditions.


ABSTRACT: Scalable methods for deposition of lead halide perovskite thin films are required to enable commercialization of the highly promising perovskite photovoltaics. Here, we have developed a slot-die coating process under ambient conditions for methylammonium lead iodide (MAPbI3) perovskite on heated substrates (about 90 °C on the substrate surface). Dense, highly crystalline perovskite films with large grains (100-200 ?m) were obtained by careful adjustment of the deposition parameters, using solutions that are similar but more dilute than those used in typical spin-coating procedures. Without any further after treatments, such as antisolvent treatment or vapor annealing, we achieved power conversion efficiencies up of 14.5% for devices with the following structure: conducting tin oxide glass (FTO)/TiO2/MAPbI3/spiro-MeOTAD/Au. The performance was limited by the significant roughness of the deposited films, resulting from the hot-casting method, and the relatively high deposition temperature, which led to a defect-rich surface due to loss of MAI.

SUBMITTER: Vijayan A 

PROVIDER: S-EPMC7493223 | biostudies-literature | 2020 May

REPOSITORIES: biostudies-literature

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Simple Method for Efficient Slot-Die Coating of MAPbI<sub>3</sub> Perovskite Thin Films in Ambient Air Conditions.

Vijayan Anuja A   Johansson Malin B MB   Svanström Sebastian S   Cappel Ute B UB   Rensmo Håkan H   Boschloo Gerrit G  

ACS applied energy materials 20200420 5


Scalable methods for deposition of lead halide perovskite thin films are required to enable commercialization of the highly promising perovskite photovoltaics. Here, we have developed a slot-die coating process under ambient conditions for methylammonium lead iodide (MAPbI<sub>3</sub>) perovskite on heated substrates (about 90 °C on the substrate surface). Dense, highly crystalline perovskite films with large grains (100-200 μm) were obtained by careful adjustment of the deposition parameters, u  ...[more]

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