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The Effect of Doping on the Digital Etching of Silicon-Selective Silicon-Germanium Using Nitric Acids.


ABSTRACT: Gate-all-around (GAA) field-effect transistors have been proposed as one of the most important developments for CMOS logic devices at the 3 nm technology node and beyond. Isotropic etching of silicon-germanium (SiGe) for the definition of nano-scale channels in vertical GAA CMOS and tunneling FETs has attracted more and more attention. In this work, the effect of doping on the digital etching of Si-selective SiGe with alternative nitric acids (HNO3) and buffered oxide etching (BOE) was investigated in detail. It was found that the HNO3 digital etching of SiGe was selective to n+-Si, p+-Si, and intrinsic Si. Extensive studies were performed. It turned out that the selectivity of SiGe/Si was dependent on the doped types of silicon and the HNO3 concentration. As a result, at 31.5% HNO3 concentration, the relative etched amount per cycle (REPC) and the etching selectivity of Si0.72Ge0.28 for n+-Si was identical to that for p+-Si. This is particularly important for applications of vertical GAA CMOS and tunneling FETs, which have to expose both the n+ and p+ sources/drains at the same time. In addition, the values of the REPC and selectivity were obtained. A controllable etching rate and atomically smooth surface could be achieved, which enhanced carrier mobility.

SUBMITTER: Li Y 

PROVIDER: S-EPMC8147633 | biostudies-literature | 2021 May

REPOSITORIES: biostudies-literature

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The Effect of Doping on the Digital Etching of Silicon-Selective Silicon-Germanium Using Nitric Acids.

Li Yangyang Y   Zhu Huilong H   Kong Zhenzhen Z   Zhang Yongkui Y   Ai Xuezheng X   Wang Guilei G   Wang Qi Q   Liu Ziyi Z   Lu Shunshun S   Xie Lu L   Huang Weixing W   Liu Yongbo Y   Li Chen C   Li Junjie J   Lin Hongxiao H   Su Jiale J   Zeng Chuanbin C   Radamson Henry H HH  

Nanomaterials (Basel, Switzerland) 20210503 5


Gate-all-around (GAA) field-effect transistors have been proposed as one of the most important developments for CMOS logic devices at the 3 nm technology node and beyond. Isotropic etching of silicon-germanium (SiGe) for the definition of nano-scale channels in vertical GAA CMOS and tunneling FETs has attracted more and more attention. In this work, the effect of doping on the digital etching of Si-selective SiGe with alternative nitric acids (HNO<sub>3</sub>) and buffered oxide etching (BOE) wa  ...[more]

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