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A Composite Microfiber for Biodegradable Stretchable Electronics.

ABSTRACT: Biodegradable stretchable electronics have demonstrated great potential for future applications in stretchable electronics and can be resorbed, dissolved, and disintegrated in the environment. Most biodegradable electronic devices have used flexible biodegradable materials, which have limited conformality in wearable and implantable devices. Here, we report a biodegradable, biocompatible, and stretchable composite microfiber of poly(glycerol sebacate) (PGS) and polyvinyl alcohol (PVA) for transient stretchable device applications. Compositing high-strength PVA with stretchable and biodegradable PGS with poor processability, formability, and mechanical strength overcomes the limits of pure PGS. As an application, the stretchable microfiber-based strain sensor developed by the incorporation of Au nanoparticles (AuNPs) into a composite microfiber showed stable current response under cyclic and dynamic stretching at 30% strain. The sensor also showed the ability to monitor the strain produced by tapping, bending, and stretching of the finger, knee, and esophagus. The biodegradable and stretchable composite materials of PGS with additive PVA have great potential for use in transient and environmentally friendly stretchable electronics with reduced environmental footprint.

SUBMITTER: Hanif A

PROVIDER: S-EPMC8468109 | biostudies-literature |

REPOSITORIES: biostudies-literature

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Biodegradable Metallic Glass for Stretchable Transient Electronics.

Project description:Biodegradable electronics are disposable green devices whose constituents decompose into harmless byproducts, leaving no residual waste and minimally invasive medical implants requiring no removal surgery. Stretchable and flexible form factors are essential in biointegrated electronic applications for conformal integration with soft and expandable skins, tissues, and organs. Here a fully biodegradable MgZnCa metallic glass (MG) film is proposed for intrinsically stretchable electrodes with a high yield limit exploiting the advantages of amorphous phases with no crystalline defects. The irregular dissolution behavior of this amorphous alloy regarding electrical conductivity and morphology is investigated in aqueous solutions with different ion species. The MgZnCa MG nanofilm shows high elastic strain (≈2.6% in the nano-tensile test) and offers enhanced stretchability (≈115% when combined with serpentine geometry). The fatigue resistance in repeatable stretching also improves owing to the wide range of the elastic strain limit. Electronic components including the capacitor, inductor, diode, and transistor using the MgZnCa MG electrode support its integrability to transient electronic devices. The biodegradable triboelectric nanogenerator of MgZnCa MG operates stably over 50 000 cycles and its fatigue resistant applications in mechanical energy harvesting are verified. In vitro cell toxicity and in vivo inflammation tests demonstrate the biocompatibility in biointegrated use.

| S-EPMC8132068 | biostudies-literature

Ultra-Stretchable Interconnects for High-Density Stretchable Electronics.

Project description:The exciting field of stretchable electronics (SE) promises numerous novel applications, particularly in-body and medical diagnostics devices. However, future advanced SE miniature devices will require high-density, extremely stretchable interconnects with micron-scale footprints, which calls for proven standardized (complementary metal-oxide semiconductor (CMOS)-type) process recipes using bulk integrated circuit (IC) microfabrication tools and fine-pitch photolithography patterning. Here, we address this combined challenge of microfabrication with extreme stretchability for high-density SE devices by introducing CMOS-enabled, free-standing, miniaturized interconnect structures that fully exploit their 3D kinematic freedom through an interplay of buckling, torsion, and bending to maximize stretchability. Integration with standard CMOS-type batch processing is assured by utilizing the Flex-to-Rigid (F2R) post-processing technology to make the back-end-of-line interconnect structures free-standing, thus enabling the routine microfabrication of highly-stretchable interconnects. The performance and reproducibility of these free-standing structures is promising: an elastic stretch beyond 2000% and ultimate (plastic) stretch beyond 3000%, with <0.3% resistance change, and >10 million cycles at 1000% stretch with <1% resistance change. This generic technology provides a new route to exciting highly-stretchable miniature devices.

| S-EPMC6189761 | biostudies-literature

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| S-EPMC4896855 | biostudies-literature

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| S-EPMC5473674 | biostudies-other

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Project description:Stretchable electronics can bridge the gap between hard planar electronic circuits and the curved, soft and elastic objects of nature. This has led to applications like conformal displays, electronic skin and soft neuroprosthetics. A remaining challenge, however, is to match the dimensions of the interfaced systems, as all require feature sizes well below 100??m. Intrinsically stretchable nanocomposites are attractive in this context as the mechanical deformations occur on the nanoscale, although methods for patterning high performance materials have been lacking. Here we address these issues by reporting on a multilayer additive patterning approach for high resolution fabrication of stretchable electronic devices. The method yields highly conductive 30??m tracks with similar performance to their macroscopic counterparts. Further, we demonstrate a three layer micropatterned stretchable electroluminescent display with pixel sizes down to 70??m. These presented findings pave the way towards future developments of high definition displays, electronic skins and dense multielectrode arrays.

| S-EPMC4860633 | biostudies-literature

Screen-Printing Fabrication and Characterization of Stretchable Electronics.

Project description:This article focuses on the fabrication and characterization of stretchable interconnects for wearable electronics applications. Interconnects were screen-printed with a stretchable silver-polymer composite ink on 50-?m thick thermoplastic polyurethane. The initial sheet resistances of the manufactured interconnects were an average of 36.2?m?/?, and half the manufactured samples withstood single strains of up to 74%. The strain proportionality of resistance is discussed, and a regression model is introduced. Cycling strain increased resistance. However, the resistances here were almost fully reversible, and this recovery was time-dependent. Normalized resistances to 10%, 15%, and 20% cyclic strains stabilized at 1.3, 1.4, and 1.7. We also tested the validity of our model for radio-frequency applications through characterization of a stretchable radio-frequency identification tag.

| S-EPMC4865752 | biostudies-literature

Stretchable and Fully Degradable Semiconductors for Transient Electronics.

Project description:The next materials challenge in organic stretchable electronics is the development of a fully degradable semiconductor that maintains stable electrical performance under strain. Herein, we decouple the design of stretchability and transience by harmonizing polymer physics principles and molecular design in order to demonstrate for the first time a material that simultaneously possesses three disparate attributes: semiconductivity, intrinsic stretchability, and full degradability. We show that we can design acid-labile semiconducting polymers to appropriately phase segregate within a biodegradable elastomer, yielding semiconducting nanofibers that concurrently enable controlled transience and strain-independent transistor mobilities. Along with the future development of suitable conductors and device integration advances, we anticipate that these materials could be used to build fully biodegradable diagnostic or therapeutic devices that reside inside the body temporarily, or environmental monitors that are placed in the field and break down when they are no longer needed. This fully degradable semiconductor represents a promising advance toward developing multifunctional materials for skin-inspired electronic devices that can address previously inaccessible challenges and in turn create new technologies.

| S-EPMC6891860 | biostudies-literature

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| S-EPMC9252516 | biostudies-literature

Highly stretchable large area woven, knitted and robust braided textile based interconnection for stretchable electronics.

Project description:With the rapid development of stretchable and wearable technologies, stretchable interconnection technology also demanded along it. Stretchable interconnections should have high stretchability and stable conductivity for use as an electrode. In addition, to develop to commercialization scale from research scale, a simple fabrication process that can be scaled up, and the stretchable interconnection should be able to be electrically connected to devices or modules directly. To date, printable conductor inks, liquid metals and stretchable structured interconnections have been reported for stretchable interconnections. These approaches have demonstrated high stretchability and conductivity, but in aspect of scale, it is appropriate to apply in micro-scale devices. For requirements of stretchability, conductivity and direct integration into meso- or centimeter-scale electronic devices or modules, here we introduce stretchable interconnections with a textile structure composed of metal fibers. The stretchable woven and knitted textiles show 67% strain and stable conductivity, and the cylindrical textile shows more than 700% strain with high strength. The stretchable textiles were fabricated using a weaving, knitting and braiding machine that can be used to produce textiles without any limit to length or area. These textiles exhibit high and stable conductivity even under deformation, and can be directly integrated into devices or modules by soldering. These high-performance stretchable textiles have great potential for commercial applications.

| S-EPMC7890051 | biostudies-literature

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