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Thermally activated intermittent dynamics of creeping crack fronts along disordered interfaces

ABSTRACT: We present a subcritical fracture growth model, coupled with the elastic redistribution of the acting mechanical stress along rugous rupture fronts. We show the ability of this model to quantitatively reproduce the intermittent dynamics of cracks propagating along weak disordered interfaces. To this end, we assume that the fracture energy of such interfaces (in the sense of a critical energy release rate) follows a spatially correlated normal distribution. We compare various statistical features from the obtained fracture dynamics to that from cracks propagating in sintered polymethylmethacrylate (PMMA) interfaces. In previous works, it has been demonstrated that such an approach could reproduce the mean advance of fractures and their local front velocity distribution. Here, we go further by showing that the proposed model also quantitatively accounts for the complex self-affine scaling morphology of crack fronts and their temporal evolution, for the spatial and temporal correlations of the local velocity fields and for the avalanches size distribution of the intermittent growth dynamics. We thus provide new evidence that an Arrhenius-like subcritical growth is particularly suitable for the description of creeping cracks.

SUBMITTER: Vincent-Dospital T

PROVIDER: S-EPMC8516960 | biostudies-literature |

REPOSITORIES: biostudies-literature

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Project description:The goal of this study is to determine how bulk vibrational properties and interfacial structure affect thermal transport at interfaces in wide band gap semiconductor systems. Time-domain thermoreflectance measurements of thermal conductance G are reported for interfaces between nitride metals and group IV (diamond, SiC, Si, and Ge) and group III-V (AlN, GaN, and cubic BN) materials. Group IV and group III-V semiconductors have systematic differences in vibrational properties. Similarly, HfN and TiN are also vibrationally distinct from each other. Therefore, comparing G of interfaces formed from these materials provides a systematic test of how vibrational similarity between two materials affects interfacial transport. For HfN interfaces, we observe conductances between 140 and 300 MW m-2 K-1, whereas conductances between 200 and 800 MW m-2 K-1 are observed for TiN interfaces. TiN forms exceptionally conductive interfaces with GaN, AlN, and diamond, that is, G > 400 MW m-2 K-1. Surprisingly, interfaces formed between vibrationally similar and dissimilar materials are similarly conductive. Thus, vibrational similarity between two materials is not a necessary requirement for high G. Instead, the time-domain thermoreflectance experiment (TDTR) data, an analysis of bulk vibrational properties, and transmission electron microscopy (TEM) suggest that G depends on two other material properties, namely, the bulk phonon properties of the vibrationally softer of the two materials and the interfacial structure. To determine how G depends on interfacial structure, TDTR and TEM measurements were conducted on a series of TiN/AlN samples prepared in different ways. Interfacial disorder at a TiN/AlN interface adds a thermal resistance equivalent to ∼1 nm of amorphous material. Our findings improve fundamental understanding of what material properties are most important for thermally conductive interfaces. They also provide benchmarks for the thermal conductance of interfaces with wide band gap semiconductors.

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Thermally activated intermittent dynamics of creeping crack fronts along disordered interfaces

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