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Bonding formation and gas absorption using Au/Pt/Ti layers for vacuum packaging.

ABSTRACT: In this study, we developed a metal multilayer that can provide hermetic sealing after degassing the assemblies and absorbing the residual gases in the package. A package without a leak path was obtained by the direct bonding of the Au/Pt/Ti layers. After packaging, annealing at 450 °C caused thermal diffusion of the Ti underlayer atoms to the inner surface, which led to absorption of the residual gas molecules. These results indicated that a wafer coated with a Au/Pt/Ti layer can provide hermetic sealing and absorb residual gases, which can simplify vacuum packaging processes in the electronics industry.

SUBMITTER: Kariya S

PROVIDER: S-EPMC8761747 | biostudies-literature | 2022

REPOSITORIES: biostudies-literature

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Bonding formation and gas absorption using Au/Pt/Ti layers for vacuum packaging.

Kariya Shingo S Matsumae Takashi T Kurashima Yuichi Y Takagi Hideki H Hayase Masanori M Higurashi Eiji E

Microsystems & nanoengineering 20220117

In this study, we developed a metal multilayer that can provide hermetic sealing after degassing the assemblies and absorbing the residual gases in the package. A package without a leak path was obtained by the direct bonding of the Au/Pt/Ti layers. After packaging, annealing at 450 °C caused thermal diffusion of the Ti underlayer atoms to the inner surface, which led to absorption of the residual gas molecules. These results indicated that a wafer coated with a Au/Pt/Ti layer can provide hermet ...[more]

PMID: 35087681

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