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Correlative AFM and Scanning Microlens Microscopy for Time-Efficient Multiscale Imaging.


ABSTRACT: With the rapid evolution of microelectronics and nanofabrication technologies, the feature sizes of large-scale integrated circuits continue to move toward the nanoscale. There is a strong need to improve the quality and efficiency of integrated circuit inspection, but it remains a great challenge to provide both rapid imaging and circuit node-level high-resolution images simultaneously using a conventional microscope. This paper proposes a nondestructive, high-throughput, multiscale correlation imaging method that combines atomic force microscopy (AFM) with microlens-based scanning optical microscopy. In this method, a microlens is coupled to the end of the AFM cantilever and the sample-facing side of the microlens contains a focused ion beam deposited tip which serves as the AFM scanning probe. The introduction of a microlens improves the imaging resolution of the AFM optical system, providing a 3-4× increase in optical imaging magnification while the scanning imaging throughput is improved ≈8×. The proposed method bridges the resolution gap between traditional optical imaging and AFM, achieves cross-scale rapid imaging with micrometer to nanometer resolution, and improves the efficiency of AFM-based large-scale imaging and detection. Simultaneously, nanoscale-level correlation between the acquired optical image and structure information is enabled by the method, providing a powerful tool for semiconductor device inspection.

SUBMITTER: Zhang T 

PROVIDER: S-EPMC9036010 | biostudies-literature | 2022 Apr

REPOSITORIES: biostudies-literature

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Correlative AFM and Scanning Microlens Microscopy for Time-Efficient Multiscale Imaging.

Zhang Tianyao T   Yu Haibo H   Shi Jialin J   Wang Xiaoduo X   Luo Hao H   Lin Daojing D   Liu Zhu Z   Su Chanmin C   Wang Yuechao Y   Liu Lianqing L  

Advanced science (Weinheim, Baden-Wurttemberg, Germany) 20220227 12


With the rapid evolution of microelectronics and nanofabrication technologies, the feature sizes of large-scale integrated circuits continue to move toward the nanoscale. There is a strong need to improve the quality and efficiency of integrated circuit inspection, but it remains a great challenge to provide both rapid imaging and circuit node-level high-resolution images simultaneously using a conventional microscope. This paper proposes a nondestructive, high-throughput, multiscale correlation  ...[more]

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