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Effects of postgate dielectric treatment on germanium-based metal-oxide-semiconductor device by supercritical fluid technology.


ABSTRACT: Supercritical fluid (SCF) technology is employed at low temperature as a postgate dielectric treatment to improve gate SiO(2)germanium (Ge) interface in a Ge-based metal-oxide-semiconductor (Ge-MOS) device. The SCF can transport the oxidant and penetrate the gate oxide layer for the oxidation of SiO(2)Ge interface at 150 degrees C. A smooth interfacial GeO(2) layer between gate SiO(2) and Ge is thereby formed after SCF treatment, and the frequency dispersion of capacitance-voltage characteristics is also effectively alleviated. Furthermore, the electrical degradation of Ge-MOS after a postgate dielectric annealing at 450 degrees C can be restored to a extent similar to the initial state.

SUBMITTER: Liu PT 

PROVIDER: S-EPMC2852447 | biostudies-other | 2010 Mar

REPOSITORIES: biostudies-other

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