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Robust pattern transfer of nanoimprinted features for sub-5-nm fabrication.


ABSTRACT: We explore the limits of a simple and facile process for transferring low aspect ratio, high-resolution features defined by nanoimprint lithography. The process involves postimprint deposition of an angle-evaporated hard mask. This widens the process window for residual resist removal and facilitates easy liftoff. An added benefit is a concomitant reduction of feature size. A postliftoff annealing step produces high pattern uniformity and additional feature size reduction. The process is extremely robust, and it enables relatively straightforward fabrication of sub-5-nm spherical structures. It is extendible to rectilinear patterns as well.

SUBMITTER: Schvartzman M 

PROVIDER: S-EPMC2761997 | biostudies-literature | 2009 Oct

REPOSITORIES: biostudies-literature

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Robust pattern transfer of nanoimprinted features for sub-5-nm fabrication.

Schvartzman Mark M   Wind Shalom J SJ  

Nano letters 20091001 10


We explore the limits of a simple and facile process for transferring low aspect ratio, high-resolution features defined by nanoimprint lithography. The process involves postimprint deposition of an angle-evaporated hard mask. This widens the process window for residual resist removal and facilitates easy liftoff. An added benefit is a concomitant reduction of feature size. A postliftoff annealing step produces high pattern uniformity and additional feature size reduction. The process is extreme  ...[more]

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