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Wiring up pre-characterized single-photon emitters by laser lithography.


ABSTRACT: Future quantum optical chips will likely be hybrid in nature and include many single-photon emitters, waveguides, filters, as well as single-photon detectors. Here, we introduce a scalable optical localization-selection-lithography procedure for wiring up a large number of single-photon emitters via polymeric photonic wire bonds in three dimensions. First, we localize and characterize nitrogen vacancies in nanodiamonds inside a solid photoresist exhibiting low background fluorescence. Next, without intermediate steps and using the same optical instrument, we perform aligned three-dimensional laser lithography. As a proof of concept, we design, fabricate, and characterize three-dimensional functional waveguide elements on an optical chip. Each element consists of one single-photon emitter centered in a crossed-arc waveguide configuration, allowing for integrated optical excitation and efficient background suppression at the same time.

SUBMITTER: Shi Q 

PROVIDER: S-EPMC4979026 | biostudies-literature | 2016 Aug

REPOSITORIES: biostudies-literature

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Wiring up pre-characterized single-photon emitters by laser lithography.

Shi Q Q   Sontheimer B B   Nikolay N N   Schell A W AW   Fischer J J   Naber A A   Benson O O   Wegener M M  

Scientific reports 20160810


Future quantum optical chips will likely be hybrid in nature and include many single-photon emitters, waveguides, filters, as well as single-photon detectors. Here, we introduce a scalable optical localization-selection-lithography procedure for wiring up a large number of single-photon emitters via polymeric photonic wire bonds in three dimensions. First, we localize and characterize nitrogen vacancies in nanodiamonds inside a solid photoresist exhibiting low background fluorescence. Next, with  ...[more]

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