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Visualization of Au Nanoparticles Buried in a Polymer Matrix by Scanning Thermal Noise Microscopy.

ABSTRACT: Several researchers have recently demonstrated visualization of subsurface features with a nanometer-scale resolution using various imaging schemes based on atomic force microscopy. Since all these subsurface imaging techniques require excitation of the oscillation of the cantilever and/or sample surface, it has been difficult to identify a key imaging mechanism. Here we demonstrate visualization of Au nanoparticles buried 300?nm into a polymer matrix by measurement of the thermal noise spectrum of a microcantilever with a tip in contact to the polymer surface. We show that the subsurface Au nanoparticles are detected as the variation in the contact stiffness and damping reflecting the viscoelastic properties of the polymer surface. The variation in the contact stiffness well agrees with the effective stiffness of a simple one-dimensional model, which is consistent with the fact that the maximum depth range of the technique is far beyond the extent of the contact stress field.

SUBMITTER: Yao A

PROVIDER: S-EPMC5314356 | biostudies-literature | 2017 Feb

REPOSITORIES: biostudies-literature

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Visualization of Au Nanoparticles Buried in a Polymer Matrix by Scanning Thermal Noise Microscopy.

Yao Atsushi A Kobayashi Kei K Nosaka Shunta S Kimura Kuniko K Yamada Hirofumi H

Scientific reports 20170217

Several researchers have recently demonstrated visualization of subsurface features with a nanometer-scale resolution using various imaging schemes based on atomic force microscopy. Since all these subsurface imaging techniques require excitation of the oscillation of the cantilever and/or sample surface, it has been difficult to identify a key imaging mechanism. Here we demonstrate visualization of Au nanoparticles buried 300 nm into a polymer matrix by measurement of the thermal noise spectrum ...[more]

PMID: 28210001

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Project description:Thermal conductivity measurements using Scanning Thermal Microscopy (SThM) usually involve heat transfer across the mechanical contact and liquid meniscus between the thermal probe and the sample. However, variations in contact conditions due to capillary effects at probe-sample contact and probe and sample wear due to mechanical contact interfere with accurate determination of the thermal conductivity. This paper presents measurements of thin film thermal conductivity using a SThM method employing a Wollaston probe in non-contact mode in synergy with detailed heat transfer analysis. In this technique, the thermal probe is scanned above the sample at a distance comparable with the mean free path of the ambient gas molecules. A Three-Dimensional Finite Element Model (3DFEM) that includes the specifics of the heat transfer between the sample and the probe in transition heat conduction regime was developed to predict the SThM probe thermal resistance and fit the thermal conductivity of the measured thin films. Proof-of-concept experimental in-plane thermal conductivity results for 240 nm and 46.6 nm Au films deposited on glass and silicon substrates were validated by experimental measurements of their electrical conductivity coupled with the Wiedemann-Franz law, with a discrepancy < 6.4%. Moreover, predictions based on a kinetic theory model for thin-film thermal conductivity agreed with the experimental results for the Au films with <6.6% discrepancy. To reduce the time and complexity of data analysis and facilitate experimental planning, an analytical model was also developed for the thermal transport between the Wollaston probe, ambient, and film-on-substrate samples. The accuracy of thin film thermal conductivity measurements using the analytical model was investigated using 3DFEM simulations. Fitted functions were developed for fast data analysis of thermal conductivity of thin films in the range of ∼100-600 W m-1 K-1 and thickness between ∼50-300 nm deposited on the two types of substrates investigated in this work, which yielded results with a discrepancy of 6-16.7% when compared to the Au films' thermal conductivity values.

Dataset Information

Visualization of Au Nanoparticles Buried in a Polymer Matrix by Scanning Thermal Noise Microscopy.

Publications

Visualization of Au Nanoparticles Buried in a Polymer Matrix by Scanning Thermal Noise Microscopy.

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