In situ MEMS testing: correlation of high-resolution X-ray diffraction with mechanical experiments and finite element analysis.

ABSTRACT: New methods are needed in microsystems technology for evaluating microelectromechanical systems (MEMS) because of their reduced size. The assessment and characterization of mechanical and structural relations of MEMS are essential to assure the long-term functioning of devices, and have a significant impact on design and fabrication. Within this study a concept for the investigation of mechanically loaded MEMS materials on an atomic level is introduced, combining high-resolution X-ray diffraction (HRXRD) measurements with finite element analysis (FEA) and mechanical testing. In situ HRXRD measurements were performed on tensile loaded single crystal silicon (SCSi) specimens by means of profile scans and reciprocal space mapping (RSM) on symmetrical (004) and (440) reflections. A comprehensi

SUBMITTER: Schifferle A 

PROVIDER: S-EPMC5425911 | biostudies-literature | 2017

REPOSITORIES: biostudies-literature