Silver oxide decomposition mediated direct bonding of silicon-based materials.
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ABSTRACT:
SUBMITTER: Matsuda T
PROVIDER: S-EPMC6041264 | biostudies-literature | 2018 Jul
REPOSITORIES: biostudies-literature
Publications
Silver oxide decomposition mediated direct bonding of silicon-based materials.
Matsuda Tomoki T Inami Kota K Motoyama Keita K Sano Tomokazu T Hirose Akio A
Scientific reports 20180711 1
Silicon-based materials are widely promising electronic components by the combination with metals in power electronics field. However, bonding metal and silicon-based materials generally requires specific surface modification due to their different chemical bonds. Here, we demonstrate a process for directly bonding metals to silicon-based materials that does not require surface treatment, based on the in situ decomposition of Ag<sub>2</sub>O paste, forming Ag nanoparticles (AgNPs). We demonstrat ...[more]
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