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Wafer-recyclable, environment-friendly transfer printing for large-scale thin-film nanoelectronics.

ABSTRACT: Transfer printing of thin-film nanoelectronics from their fabrication wafer commonly requires chemical etching on the sacrifice of wafer but is also limited by defects with a low yield. Here, we introduce a wafer-recyclable, environment-friendly transfer printing process that enables the wafer-scale separation of high-performance thin-film nanoelectronics from their fabrication wafer in a defect-free manner that enables multiple reuses of the wafer. The interfacial delamination is enabled through a controllable cracking phenomenon in a water environment at room temperature. The physically liberated thin-film nanoelectronics can be then pasted onto arbitrary places of interest, thereby endowing the particular surface with desirable add-on electronic features. Systematic experimental, theoretical, and computational studies reveal the underlying mechanics mechanism and guide manufacturability for the transfer printing process in terms of scalability, controllability, and reproducibility.

SUBMITTER: Wie DS

PROVIDER: S-EPMC6077709 | biostudies-literature | 2018 Jul

REPOSITORIES: biostudies-literature

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Wafer-recyclable, environment-friendly transfer printing for large-scale thin-film nanoelectronics.

Wie Dae Seung DS Zhang Yue Y Kim Min Ku MK Kim Bongjoong B Park Sangwook S Kim Young-Joon YJ Irazoqui Pedro P PP Zheng Xiaolin X Xu Baoxing B Lee Chi Hwan CH

Proceedings of the National Academy of Sciences of the United States of America 20180716 31

Transfer printing of thin-film nanoelectronics from their fabrication wafer commonly requires chemical etching on the sacrifice of wafer but is also limited by defects with a low yield. Here, we introduce a wafer-recyclable, environment-friendly transfer printing process that enables the wafer-scale separation of high-performance thin-film nanoelectronics from their fabrication wafer in a defect-free manner that enables multiple reuses of the wafer. The interfacial delamination is enabled throug ...[more]

PMID: 30012591

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Dataset Information

Wafer-recyclable, environment-friendly transfer printing for large-scale thin-film nanoelectronics.

Publications

Wafer-recyclable, environment-friendly transfer printing for large-scale thin-film nanoelectronics.

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