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Voltage-Controlled Magnetoresistance in Silicon Nanowire Transistors.

ABSTRACT: Magneto-electronic logic is an innovative approach to performing high-efficiency computations. Additionally, the ultra-large scale integration requirement for computation strongly suggests exploiting magnetoresistance effects in non-magnetic semiconductor materials. Here, we demonstrate the magnetoresistance effect in a silicon nanowire field effect transistor (SNWT) fabricated by complementary metal-oxide-semiconductor (CMOS)-compatible technology. Our experimental results show that the sign and the magnitude of the magnetoresistance in SNWTs can be effectively controlled by the drain-source voltage and the gate-source voltage, respectively, playing the role of a multi-terminal tunable magnetoresistance device. Various current models are established and in good agreement with the experimental results that describe the impact of electrical voltage and magnetic field on magnetoresistance, which provides design feasibility for the high-density magneto-electronic circuit. Such findings will further pave the way for nanoscale silicon-based magneto-electronics logic devices and show a possible path beyond the developmental limits of CMOS logic.

SUBMITTER: Zhang Y

PROVIDER: S-EPMC6185961 | biostudies-literature |

REPOSITORIES: biostudies-literature

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Project description:This work demonstrates the novel concept of a mixed-dimensional reconfigurable field effect transistor (RFET) by combining a one-dimensional (1D) channel material such as a silicon (Si) nanowire with a two-dimensional (2D) material as a gate dielectric. An RFET is an innovative device that can be dynamically programmed to perform as either an n- or p-FET by applying appropriate gate potentials. In this work, an insulating 2D material, hexagonal boron nitride (hBN), is introduced as a gate dielectric and encapsulation layer around the nanowire in place of a thermally grown or atomic-layer-deposited oxide. hBN flake was mechanically exfoliated and transferred onto a silicon nanowire-based RFET device using the dry viscoelastic stamping transfer technique. The thickness of the hBN flakes was investigated by atomic force microscopy and transmission electron microscopy. The ambipolar transfer characteristics of the Si-hBN RFETs with different gating architectures showed a significant improvement in the device's electrical parameters due to the encapsulation and passivation of the nanowire with the hBN flake. Both n- and p-type characteristics measured through the top gate exhibited a reduction of hysteresis by 10-20 V and an increase in the on-off ratio (ION/IOFF) by 1 order of magnitude (up to 108) compared to the values measured for unpassivated nanowire. Specifically, the hBN encapsulation provided improved electrostatic top gate coupling, which is reflected in the enhanced subthreshold swing values of the devices. For a single nanowire, an improvement up to 0.97 and 0.5 V/dec in the n- and p-conduction, respectively, is observed. Due to their dynamic switching and polarity control, RFETs boast great potential in reducing the device count, lowering power consumption, and playing a crucial role in advanced electronic circuitry. The concept of mixed-dimensional RFET could further strengthen its functionality, opening up new pathways for future electronics.

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Voltage-Controlled Magnetoresistance in Silicon Nanowire Transistors.

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