Using Dicyclopentadiene-Derived Polyarylates as Epoxy Curing Agents To Achieve High T _g and Low Dielectric Epoxy Thermosets.

ABSTRACT: To achieve high-T _g and low-dielectric epoxy thermosets, four dicyclopentadiene-derived polyarylates (26-P, 26-M, 236-P, and 236-M) were prepared from 2,6-dimethyl (or 2,3,6-trimethyl) phenol-dicyclopentadiene adduct with terephthaloyl (or isophthaloyl) chloride by high-temperature solution polymerization. The resulting polyarylates, exhibiting active ester linkages (Ph-O-(C=O)-) are found to be reactive toward a commercial dicyclopentadiene phenol epoxy (HP7200) in the presence of some lone-pair electron-containing compounds. Five compounds including 4-dimethylaminopyridine (DMAP), imidazole, 2-methylimidazole, triphenylphosphine, and triphenylimidazole have been evaluated as a catalyst for the curing reactions. We found that DMAP, with the smallest pK _b

SUBMITTER: Lin CM 

PROVIDER: S-EPMC6641589 | biostudies-literature | 2018 Apr

REPOSITORIES: biostudies-literature