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Reproducible Performance Improvements to Monolayer MoS2 Transistors through Exposed Material Forming Gas Annealing.


ABSTRACT: Metal-mediated exfoliation has been demonstrated as a promising approach for obtaining large-area flakes of two-dimensional (2D) materials to fabricate prototypical nanoelectronics. However, several processing challenges related to organic contamination at the interface of a 2D material and gate oxide must be overcome to realize robust devices with high yields. Here, we demonstrate an optimized process to realize high-performance field-effect transistor (FET) arrays from large-area (?5000 ?m2), monolayer MoS2 with a yield of 85%. A central element of this process is an exposed material forming gas anneal (EM-FGA) that results in uniform FET performance metrics (i.e., field-effect mobilities, threshold voltages, and contact performance). Complementary analytical measurements show that the EM-FGA process reduces deleterious channel doping effects by decreasing organic contamination while also reducing the prevalence of insulating molybdenum oxide, effectively improving the MoS2-gate oxide interface. The uniform FET performance metrics and high device yield achieved by applying the EM-FGA technique on large-area 2D material flakes will help advance the fabrication of complex 2D nanoelectronic devices and demonstrate the need for improved engineering of the 2D material-gate oxide interface.

SUBMITTER: Guros NB 

PROVIDER: S-EPMC6702458 | biostudies-literature | 2019 May

REPOSITORIES: biostudies-literature

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Reproducible Performance Improvements to Monolayer MoS<sub>2</sub> Transistors through Exposed Material Forming Gas Annealing.

Guros Nicholas B NB   Le Son T ST   Zhang Siyuan S   Sperling Brent A BA   Klauda Jeffery B JB   Richter Curt A CA   Balijepalli Arvind A  

ACS applied materials & interfaces 20190429 18


Metal-mediated exfoliation has been demonstrated as a promising approach for obtaining large-area flakes of two-dimensional (2D) materials to fabricate prototypical nanoelectronics. However, several processing challenges related to organic contamination at the interface of a 2D material and gate oxide must be overcome to realize robust devices with high yields. Here, we demonstrate an optimized process to realize high-performance field-effect transistor (FET) arrays from large-area (∼5000 μm<sup  ...[more]

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