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Dataset for additional information on the evaluation of thermal properties of thin films by IR radiometry using a comprehensive set of Zr-O-N thin films.

ABSTRACT: This paper provides additional negative data regarding the paper Evaluation of thermal properties of thin films by IR radiometry using a comprehensive set of Zr-O-N thin films [1]. In that paper, a matrix of samples was prepared to evaluate the so-called Extremum method for the analysis of Infrared (IR) radiometry data. Such matrix was composed by 3 types of films with 4 different thickness in 3 types of substrates, totalizing 36 samples in total. The data of this paper can be divided into three separate categories: i) lack of adhesion of the films deposited on Teflon, simultaneously to the films deposited on other substrates. ii) Improvement of the signal and signal-to-noise ratio on samples that did not present an extremum (minimum or maximum) using the initial (more conventional) way of measurement. iii) It is also presented a failed fitting of the IR radiometry data created with entangled material parameters. All this data is relevant for researchers devoted to measurement of thermal properties of thin films by IR radiometry that employ the two layer model and Extremum Method.

SUBMITTER: da Silva-Oliveira CI

PROVIDER: S-EPMC7049593 | biostudies-literature | 2020 Apr

REPOSITORIES: biostudies-literature

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Dataset for additional information on the evaluation of thermal properties of thin films by IR radiometry using a comprehensive set of Zr-O-N thin films.

da Silva-Oliveira C I CI Martinez-Martinez D D Couto F M FM Cunha L L Macedo F F

Data in brief 20200214

This paper provides additional negative data regarding the paper <i>Evaluation of thermal properties of thin films by IR radiometry using a comprehensive set of Zr-O-N thin films</i> [1]. In that paper, a matrix of samples was prepared to evaluate the so-called Extremum method for the analysis of Infrared (IR) radiometry data. Such matrix was composed by 3 types of films with 4 different thickness in 3 types of substrates, totalizing 36 samples in total. The data of this paper can be divided int ...[more]

PMID: 32140509

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Project description:Thermal conductivity measurements using Scanning Thermal Microscopy (SThM) usually involve heat transfer across the mechanical contact and liquid meniscus between the thermal probe and the sample. However, variations in contact conditions due to capillary effects at probe-sample contact and probe and sample wear due to mechanical contact interfere with accurate determination of the thermal conductivity. This paper presents measurements of thin film thermal conductivity using a SThM method employing a Wollaston probe in non-contact mode in synergy with detailed heat transfer analysis. In this technique, the thermal probe is scanned above the sample at a distance comparable with the mean free path of the ambient gas molecules. A Three-Dimensional Finite Element Model (3DFEM) that includes the specifics of the heat transfer between the sample and the probe in transition heat conduction regime was developed to predict the SThM probe thermal resistance and fit the thermal conductivity of the measured thin films. Proof-of-concept experimental in-plane thermal conductivity results for 240 nm and 46.6 nm Au films deposited on glass and silicon substrates were validated by experimental measurements of their electrical conductivity coupled with the Wiedemann-Franz law, with a discrepancy < 6.4%. Moreover, predictions based on a kinetic theory model for thin-film thermal conductivity agreed with the experimental results for the Au films with <6.6% discrepancy. To reduce the time and complexity of data analysis and facilitate experimental planning, an analytical model was also developed for the thermal transport between the Wollaston probe, ambient, and film-on-substrate samples. The accuracy of thin film thermal conductivity measurements using the analytical model was investigated using 3DFEM simulations. Fitted functions were developed for fast data analysis of thermal conductivity of thin films in the range of ∼100-600 W m-1 K-1 and thickness between ∼50-300 nm deposited on the two types of substrates investigated in this work, which yielded results with a discrepancy of 6-16.7% when compared to the Au films' thermal conductivity values.

Dataset Information

Dataset for additional information on the evaluation of thermal properties of thin films by IR radiometry using a comprehensive set of Zr-O-N thin films.

Publications

Dataset for additional information on the evaluation of thermal properties of thin films by IR radiometry using a comprehensive set of Zr-O-N thin films.

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