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A powder-metallurgy-based strategy toward three-dimensional graphene-like network for reinforcing copper matrix composites.


ABSTRACT: Three-dimensional graphene network is a promising structure for improving both the mechanical properties and functional capabilities of reinforced polymer and ceramic matrix composites. However, direct application in a metal matrix remains difficult due to the reason that wetting is usually unfavorable in the carbon/metal system. Here we report a powder-metallurgy based strategy to construct a three-dimensional continuous graphene network architecture in a copper matrix through thermal-stress-induced welding between graphene-like nanosheets grown on the surface of copper powders. The interpenetrating structural feature of the as-obtained composites not only promotes the interfacial shear stress to a high level and thus results in significantly enhanced load transfer strengthening and crack-bridging toughening simultaneously, but also constructs additional three-dimensional hyperchannels for electrical and thermal conductivity. Our approach offers a general way for manufacturing metal matrix composites with high overall performance.

SUBMITTER: Zhang X 

PROVIDER: S-EPMC7265306 | biostudies-literature | 2020 Jun

REPOSITORIES: biostudies-literature

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A powder-metallurgy-based strategy toward three-dimensional graphene-like network for reinforcing copper matrix composites.

Zhang Xiang X   Xu Yixin Y   Wang Miaocao M   Liu Enzuo E   Zhao Naiqin N   Shi Chunsheng C   Lin Dong D   Zhu Fulong F   He Chunnian C  

Nature communications 20200602 1


Three-dimensional graphene network is a promising structure for improving both the mechanical properties and functional capabilities of reinforced polymer and ceramic matrix composites. However, direct application in a metal matrix remains difficult due to the reason that wetting is usually unfavorable in the carbon/metal system. Here we report a powder-metallurgy based strategy to construct a three-dimensional continuous graphene network architecture in a copper matrix through thermal-stress-in  ...[more]

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