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A bioinspired Au-Cu1.97S/Cu2S film with efficient low-angle-dependent and thermal-assisted photodetection properties

ABSTRACT: Summary Inspired by the geological processes, this study develops an innovative low-concentration-ratio H2 reduction method to reduce the stoichiometric Au-CuS nanoparticles to produce completely reduced stoichiometric Cu2S with “invisible” Au achieved for solid solution Au enhancement. A stable Au-Cu1.97S/Cu2S micro/nano-composite is then formed by spontaneous oxidation. From this composite, in combination with biomimetic technology, an omnidirectional photoabsorption and thermoregulated film (Au-Cu1.97S/Cu2S-C-T_FW) is designed and fabricated as a photothermal-assisted and temperature-autoregulated photodetector for broadband and low-angle-dependent photodetection that presents good performance with high responsivity (26.37 mA/W), detectivity (1.25×108 Jones), and good stability at low bias (0.5 V). Solid solution Au exhibits significantly enhanced photodetection (1,000 times). This study offers a new concept for improving the stability and photoelectric properties of copper chalcogenides. Moreover, it opens up a new avenue toward enhancing the performance of optoelectronic and photovoltaic devices using solid solution metal atoms and thermal-assisted, anti-overheating temperature autoregulation. Graphical abstract Highlights • Inspired by geological process, solid solution-atom enhancement in photoresponse• A photothermal-assist-enhanced and temperature-autoregulated photodetector• The photodetector exhibited excellent low-angle-dependent photodetection Devices; Materials Property; Nanomaterials

SUBMITTER: Tian J

PROVIDER: S-EPMC7920830 | biostudies-literature | 2021 Feb

REPOSITORIES: biostudies-literature

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Project description:BackgroundBiofilm formation on medical device surfaces is a persistent problem that shelters bacteria and encourages infections and implant rejection. One promising approach to tackle this problem is to coat the medical device with an antimicrobial material. In this work, for the first time, we impart antimicrobial functionality to Ti3Au intermetallic alloy thin film coatings, while maintaining their superior mechanical hardness and biocompatibility.MethodsA mosaic Ti sputtering target is developed to dope controlled amounts of antimicrobial elements of Ag and Cu into a Ti3Au coating matrix by precise control of individual target power levels. The resulting Ti3Au-Ag/Cu thin film coatings are then systematically characterised for their structural, chemical, morphological, mechanical, corrosion, biocompatibility-cytotoxicity and antimicrobial properties.ResultsX-ray diffraction patterns reveal the formation of a super hard β-Ti3Au phase, but the thin films undergo a transition in crystal orientation from (200) to (211) with increasing Ag concentration, whereas introduction of Cu brings no observable changes in crystal orientation. Scanning and transmission electron microscopy analysis show the polyhedral shape of the Ti3Au crystal but agglomeration of Ag particles between crystal grains begins at 1.2 at% Ag and develops into large granules with increasing Ag concentration up to 4.1 at%. The smallest doping concentration of 0.2 at% Ag raises the hardness of the thin film to 14.7 GPa, a 360% improvement compared to the ∼4 GPa hardness of the standard Ti6Al4V base alloy. On the other hand, addition of Cu brings a 315-330% improvement in mechanical hardness of films throughout the entire concentration range of 0.5-7.1 at%. The thin films also show good electrochemical corrosion resistance and a > tenfold reduction in wear rate compared to Ti6Al4V alloy. All thin film samples exhibit very safe cytotoxic profiles towards L929 mouse fibroblast cells when analysed with Alamar blue assay, with ion leaching concentrations lower than 0.2 ppm for Ag and 0.08 ppm for Cu and conductivity tests reveal the positive effect of increased conductivity on myogenic differentiation. Antimicrobial tests show a drastic reduction in microbial survival over a short test period of < 20 min for Ti3Au films doped with Ag or Cu concentrations as low as 0.2-0.5 at%.ConclusionTherefore, according to these results, this work presents a new antimicrobial Ti3Au-Ag/Cu coating material with excellent mechanical performance with the potential to develop wear resistant medical implant devices with resistance to biofilm formation and bacterial infection.

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A bioinspired Au-Cu1.97S/Cu2S film with efficient low-angle-dependent and thermal-assisted photodetection properties

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