Project description:Dielectric analysis (DEA) is a thermal analysis technique primarily developed to optimize polymer cure profiles in manufacturing facilities to reduce scrap and to diagnose insulation. The recent implementation of this technique to characterize the behavior of new in-house electrical insulation formulations has been advantageous in providing a better understanding of insulation exposed to thermal and electrical stresses at their anticipated operating temperatures and frequencies. Because the dielectric properties of in-house high-voltage insulation formulations are not well understood, DEA was initially carried out using a well-established commercially available polyimide film. This report documents the findings from using dielectric thermal analysis to characterize the electrical properties of commercially available polyimide films and in-house polyimide composite formulations that were exposed to environments anticipated in high-voltage electric motors. The effects of moisture content and thermal aging on the dielectric properties of commercial polyimide are also reported. Information presented in this paper illustrates that DEA can be used as a viable technique to screen candidates for new electrical insulation.
Project description:Traditional polymers are both electrically and thermally insulating. The development of electrically conductive polymers has led to novel applications such as flexible displays, solar cells, and wearable biosensors. As in the case of electrically conductive polymers, the development of polymers with high thermal conductivity would open up a range of applications in next-generation electronic, optoelectronic, and energy devices. Current research has so far been limited to engineering polymers either by strong intramolecular interactions, which enable efficient phonon transport along the polymer chains, or by strong intermolecular interactions, which enable efficient phonon transport between the polymer chains. However, it has not been possible until now to engineer both interactions simultaneously. We report the first realization of high thermal conductivity in the thin film of a conjugated polymer, poly(3-hexylthiophene), via bottom-up oxidative chemical vapor deposition (oCVD), taking advantage of both strong C=C covalent bonding along the extended polymer chain and strong ?-? stacking noncovalent interactions between chains. We confirm the presence of both types of interactions by systematic structural characterization, achieving a near-room temperature thermal conductivity of 2.2 W/m·K, which is 10 times higher than that of conventional polymers. With the solvent-free oCVD technique, it is now possible to grow polymer films conformally on a variety of substrates as lightweight, flexible heat conductors that are also electrically insulating and resistant to corrosion.
Project description:Polymers are widely used in daily life, but exhibit low strength and low thermal conductivity as compared to most structural materials. In this work, we develop crystalline polymer nanofibers that exhibit a superb combination of ultra-high strength (11?GPa) and thermal conductivity, exceeding any existing soft materials. Specifically, we demonstrate unique low-dimensionality phonon physics for thermal transport in the nanofibers by measuring their thermal conductivity in a broad temperature range from 20 to 320?K, where the thermal conductivity increases with increasing temperature following an unusual ~T1 trend below 100?K and eventually peaks around 130-150?K reaching a metal-like value of 90?W?m-1?K-1, and then decays as 1/T. The polymer nanofibers are purely electrically insulating and bio-compatible. Combined with their remarkable lightweight-thermal-mechanical concurrent functionality, unique applications in electronics and biology emerge.
Project description:With the rapid development of 5G information technology, thermal conductivity/dissipation problems of highly integrated electronic devices and electrical equipment are becoming prominent. In this work, "high-temperature solid-phase & diazonium salt decomposition" method is carried out to prepare benzidine-functionalized boron nitride (m-BN). Subsequently, m-BN/poly(p-phenylene benzobisoxazole) nanofiber (PNF) nanocomposite paper with nacre-mimetic layered structures is prepared via sol-gel film transformation approach. The obtained m-BN/PNF nanocomposite paper with 50 wt% m-BN presents excellent thermal conductivity, incredible electrical insulation, outstanding mechanical properties and thermal stability, due to the construction of extensive hydrogen bonds and π-π interactions between m-BN and PNF, and stable nacre-mimetic layered structures. Its λ∥ and λ⊥ are 9.68 and 0.84 W m-1 K-1, and the volume resistivity and breakdown strength are as high as 2.3 × 1015 Ω cm and 324.2 kV mm-1, respectively. Besides, it also presents extremely high tensile strength of 193.6 MPa and thermal decomposition temperature of 640 °C, showing a broad application prospect in high-end thermal management fields such as electronic devices and electrical equipment.
Project description:Electrically insulating polymers are indispensable for electronic and energy applications, but their poor thermal conduction has increasingly become a bottleneck for high-performance devices. Highly drawn low-dimensional polymeric fibers and thin films can exhibit metallic conductivity. Extending this to bulk materials required by real world applications is prohibitive due to the additional interfacial thermal conduction barriers. It is demonstrated that highly aligned ultrahigh molecular weight polyethylene microfibers can be incorporated into a silicone matrix to yield a fully organic bulk polymer composite with a continuous vertical phonon pathway. This leads to a perpendicular thermal conductivity of 38.27 W m-1 K-1 , at par with metals and two orders of magnitude higher than other bulk organic polymers. Taking further advantage of the mechanical flexibility of the microfibers, the processing method offers the freedom to tailor heat transfer pathways in a macroscopic 3D space. The material/process opens up opportunities for efficient thermal management in high-performance devices.
Project description:Thermally conductive but electrically insulating materials are highly desirable for thermal management applications in electrical encapsulation and future energy fields, for instance, superconducting magnet insulation in nuclear fusion systems. However, the traditional approaches usually suffer from inefficient and anisotropic enhancement of thermal conductivity or deterioration of electrical insulating property. In this study, using boron nitride sphere (BNS) agglomerated by boron nitride (BN) sheets as fillers, we fabricate a series of epoxy/BNS composites by a new approach, namely gravity-mix, and realize the controllable BNS loading fractions in the wide range of 5-40 wt%. The composites exhibited thermal conductivity of about 765% and enhancement at BNS loading of 40 wt%. The thermal conductivity up to 0.84 W·m-1·K-1 at 77 K and 1.66 W·m-1·K-1 at 298 K was observed in preservation of a higher dielectric constant and a lower dielectric loss, as expected, because boron nitride is a naturally dielectric material. It is worth noting that the thermal property was almost isotropous on account of the spherical structure of BNS in epoxy. Meanwhile, the reduction of the coefficient of thermal expansion (CTE) was largely reduced, by up to 42.5% at a temperature range of 77-298 K.
Project description:Due to their unique properties, polymers - typically thermal insulators - can open up opportunities for advanced thermal management when they are transformed into thermal conductors. Recent studies have shown polymers can achieve high thermal conductivity, but the transport mechanisms have yet to be elucidated. Here we report polyethylene films with a high thermal conductivity of 62 Wm-1 K-1, over two orders-of-magnitude greater than that of typical polymers (~0.1 Wm-1 K-1) and exceeding that of many metals and ceramics. Structural studies and thermal modeling reveal that the film consists of nanofibers with crystalline and amorphous regions, and the amorphous region has a remarkably high thermal conductivity, over ~16 Wm-1 K-1. This work lays the foundation for rational design and synthesis of thermally conductive polymers for thermal management, particularly when flexible, lightweight, chemically inert, and electrically insulating thermal conductors are required.
Project description:The surface modification of nanoparticles (NPs) is crucial for fabricating polymer nanocomposites (NCs) with high dielectric permittivity. Here, we systematically studied the effect of surface functionalization of TiO2 and BaTiO3 NPs to enhance the dielectric permittivity of polyvinylidene fluoride (PVDF) NCs by 23 and 74%, respectively, measured at a frequency of 1 kHz. To further increase the dielectric permittivity of PVDF/NPs-based NCs, we developed a new hetero-phase filler-based approach that is cost-effective and easy to implement. At a 1:3 mixing ratio of TiO2:BaTiO3 NPs, the dielectric constant of the ensuing NC is found to be 50.2, which is comparable with the functionalized BaTiO3-based NC. The highest dielectric constant value of 76.1 measured at 1 kHz was achieved using the (3-aminopropyl)triethoxysilane (APTES)-modified hetero-phase-based PVDF composite at a volume concentration of 5%. This work is an important step toward inexpensive and easy-to-process high-k nanocomposite dielectrics.
Project description:The thermal conductivity of epoxy nanocomposites filled with self-assembled hybrid nanoparticles composed of multilayered graphene nanoplatelets and anatase nanoparticles was described using an analytical model based on the effective medium approximation with a reasonable amount of input data. The proposed effective thickness approach allowed for the simplification of the thermal conductivity simulations in hybrid graphene@anatase TiO2 nanosheets by including the phenomenological thermal boundary resistance. The sensitivity of the modeled thermal conductivity to the geometrical and material parameters of filling particles and the host polymer matrix, filler's mass concentration, self-assembling degree, and Kapitza thermal boundary resistances at emerging interfaces was numerically evaluated. A fair agreement of the calculated and measured room-temperature thermal conductivity was obtained.
Project description:Polymer-based composites with high thermal conductivity and dielectric breakdown strength have gained increasing attention due to their significant application potential in both power electronic devices and power equipment. In this study, we successfully prepared novel sandwich AlN/epoxy composites with various layer thicknesses, showing simultaneously and remarkably enhanced dielectric breakdown strength and thermal conductivity. The most optimized sandwich composite, with an outer layer thickness of 120 μm and an inner layer thickness of 60 μm (abbreviated as 120-60) exhibits a high through-plane thermal conductivity of 0.754 W/(m·K) (4.1 times of epoxy) and has a dielectric breakdown strength of 69.7 kV/mm, 8.1% higher compared to that of epoxy. The sandwich composites also have higher in-plane thermal conductivity (1.88 W/(m·K) for 120-60) based on the novel parallel models. The sandwich composites with desirable thermal and electrical properties are very promising for application in power electronic devices and power equipment.