Browse
Submit Data
Databases
API
Help

Dataset Information

26 Views

0 Connections

0 Citations

0 Reanalyses

0 Downloads

Omics score: 0

Photo-oxidative degradation of polyacids derived ceria nanoparticle modulation for chemical mechanical polishing

ABSTRACT: The effects of photo-oxidative degradation of polyacids at various concentrations and with different durations of ultraviolet (UV) irradiation on the photo-reduction of ceria nanoparticles were investigated. The effect of UV-treated ceria on the performance of chemical mechanical polishing (CMP) for the dielectric layer was also evaluated. When the polyacids were exposed to UV light, they underwent photo-oxidation with consumption of the dissolved oxygen in slurry. UV-treated ceria particles formed oxygen vacancies by absorbing photon energy, resulting in increased Ce3+ ions concentration on the surface, and when the oxygen level of the solution was lowered by the photo-oxidation of polymers, the formation of Ce3+ ions was promoted from 14.2 to 36.5%. Furthermore, chain scissions of polymers occurred during the oxidation process, and polyacids with lower molecular weights were found to be effective in ceria particle dispersion in terms of the decrease in the mean diameter and size distribution maintaining under 0.1 of polydispersity index. With increasing polyacid concentration and UV irradiation time, the Ce3+ concentration and the dispersity of ceria both increased due to the photo-oxidative degradation of the polymer; this enhanced the CMP performance in terms of 87% improved material removal rate and 48% lowered wafer surface roughness.

SUBMITTER: Kim E

PROVIDER: S-EPMC8803865 | biostudies-literature |

REPOSITORIES: biostudies-literature

ACCESS DATA

Json Xml

Similar Datasets

Effect of chemical mechanical polishing on surface nature of titanium implants FT-IR and wettability data of titanium implants surface after chemical mechanical polishing implementation.

Project description:Bioactivity of titanium depends on the quality and characteristics of its surface oxide film. Through implementation of chemical mechanical polishing (CMP) process on titanium plates, a protective oxide (titania) film grows on the titanium based implant surface. In this article, surface properties of the titanium oxide are investigated as a function of the CMP process conditions. Surface responses were evaluated in terms of wettability, nano-scale surface roughness and material removal rates (MRR). Surface chemical compositions were also evaluated through Fourier transform infrared spectroscopy (FT-IR).

| S-EPMC5137329 | biostudies-literature

A novel approach of chemical mechanical polishing for cadmium zinc telluride wafers.

Project description:A novel approach of chemical mechanical polishing (CMP) is developed for cadmium zinc telluride (CdZnTe or CZT) wafers. The approach uses environment-friendly slurry that consists of mainly silica, hydrogen peroxide, and citric acid. This is different from the previously reported slurries that are usually composed of strong acid, alkali, and bromine methanol, and are detrimental to the environment and operators. Surface roughness 0.5 nm and 4.7 nm are achieved for Ra and peak-to-valley (PV) values respectively in a measurement area of 70 × 50 μm(2), using the developed novel approach. Fundamental polishing mechanisms are also investigated in terms of X-ray photoelectron spectroscopy (XPS) and electrochemical measurements. Hydrogen peroxide dominates the passivating process during the CMP of CZT wafers, indicating by the lowest passivation current density among silica, citric acid and hydrogen peroxide solution. Chemical reaction equations are proposed during CMP according to the XPS and electrochemical measurements.

| S-EPMC4880934 | biostudies-other

KDP Aqueous Solution-in-Oil Microemulsion for Ultra-Precision Chemical-Mechanical Polishing of KDP Crystal.

Project description:A novel functional KH₂PO₄ (KDP) aqueous solution-in-oil (KDP aq/O) microemulsion system for KDP crystal ultra-precision chemical-mechanical polishing (CMP) was prepared. The system, which consisted of decanol, Triton X-100, and KH₂PO₄ aqueous solution, was available at room temperature. The functional KDP aq/O microemulsion system was systematically studied and applied as polishing solution to KDP CMP technology. In this study, a controlled deliquescent mechanism was proposed for KDP polishing with the KDP aq/O microemulsion. KDP aqueous solution, the chemical etchant in the polishing process, was caged into the micelles in the microemulsion, leading to a limitation of the reaction between the KDP crystal and KDP aqueous solution only if the microemulsion was deformed under the effect of the external force. Based on the interface reaction dynamics, KDP aqueous solutions with different concentrations (cKDP) were applied to replace water in the traditional water-in-oil (W/O) microemulsion. The practicability of the controlled deliquescent mechanism was proved by the decreasing material removal rate (MRR) with the increasing of the cKDP. As a result, the corrosion pits on the KDP surface were avoided to some degree. Moreover, the roughnesses of KDP with KDP aq/O microemulsion (cKDP was changed from 10 mM to 100 mM) as polishing solutions were smaller than that with the W/O microemulsion. The smallest surface root-mean-square roughness of 1.5 nm was obtained at a 30 mmol/L KDP aq solution, because of the most appropriate deliquescent rate and MRR.

| S-EPMC5503384 | biostudies-literature

Chemical and mechanical modulation of polymeric micelle assembly.

Project description:Recently, polymeric micelles self-assembled from amphiphilic polymers have been studied for various industrial and biomedical applications. This nanoparticle self-assembly typically occurs in a solvent-exchange process. In this process, the quality of the resulting particles is uncontrollably mediated by polymeric solubility and mixing conditions. Here, we hypothesized that improving the solubility of an amphiphilic polymer in an organic solvent via chemical modification while controlling the mixing rate of organic and aqueous phases would enhance control over particle morphology and size. We examined this hypothesis by synthesizing a poly(2-hydroxyethyl)aspartamide (PHEA) grafted with controlled numbers of octadecyl (C18) chains and oligovaline groups (termed "oligovaline-PHEA-C18"). The mixing rate of DMF and water was controlled either by microfluidic mixing of laminar DMF and water flows or through turbulent bulk mixing. Interestingly, oligovaline-PHEA-C18 exhibited an increased solubility in DMF compared with PHEA-C18, as demonstrated by an increase of mixing energy. In addition, increasing the mixing rate between water and DMF using the microfluidic mixer resulted in a decrease of the diameter of the resulting polymeric micelles, as compared with the particles formed from a bulk mixing process. Overall, these findings will expand the parameter space available to control particle self-assembly while also serving to improve existing nanoparticle processing techniques.

| S-EPMC5501961 | biostudies-literature

Numerical Analysis of the Effect of Retaining Ring Structure on the Chemical Mechanical Polishing Abrasive Motion State.

Project description:Optimizing the retaining ring structure can improve the quality of Chemical Mechanical Polishing (CMP). This study establishes a two-dimensional Computational Fluid Dynamics-Discrete Element Method (CFD-DEM) model, while the model is validated by experiments. The results graphically demonstrate the influence of the retaining ring groove design on the motion of the slurry abrasive particles. The size of the retaining ring groove appears to have a threshold value, above which the abrasives start to have significant distribution in the wafer region. As the groove size continues to increase, the number of abrasives entering the ring increases abruptly and oscillates at specific nodes. The abrasive transfer rate increases with the number of grooves in the early stage but reaches a limit at a certain number of grooves. Meanwhile, the retaining ring position affects the transfer of the abrasives. This study provides a base for optimizing the design of retaining rings.

| S-EPMC9821106 | biostudies-literature

Changing the calcination temperature to tune the microstructure and polishing properties of ceria octahedrons.

Project description:Ceria octahedrons with different microstructure and surface characteristics were prepared by calcining an octahedral CeO2 precursor self-assembled from spherical primary nanocrystals of about 5 nm at 500-900 °C. Structural characterization revealed that with the calcination temperature increasing from 500 to 700 °C, the products maintained a hierarchical structure and primary nanocrystals changed from spherical to octahedral particles. Significant fusion occurred between the primary nanocrystals and the surface of the octahedrons became smooth at the calcination temperature of 800 °C. Single crystal CeO2 octahedrons were formed when the calcination temperature reached 900 °C. The change in microstructure induced by elevated calcination temperature led to increased mechanical hardness and decreased surface chemical activity (specific surface area and surface Ce3+ concentration) of the octahedrons, which had an impact on their polishing performance. The polishing experiments on K9 glass showed that the polishing rate first increased and then decreased with the increment of calcination temperature, indicating that in addition to the mechanical hardness, the surface chemical activity of the octahedrons is also important for material removal. Owing to the best matching of chemical activity and mechanical hardness, CeO2 octahedrons calcinated at 700 °C exhibited the highest polishing rate and the best surface quality for K9 glass.

| S-EPMC9168675 | biostudies-literature

Polymer link breakage of polyimide-film-surface using hydrolysis reaction accelerator for enhancing chemical-mechanical-planarization polishing-rate.

Project description:In this study, the chemical decomposition of a polyimide-film (i.e., a PI-film)-surface into a soft-film-surface containing negatively charged pyromellitic dianhydride (PMDA) and neutral 4,4'-oxydianiline (ODA) was successfully performed. The chemical decomposition was conducted by designing the slurry containing 350 nm colloidal silica abrasive and small molecules with amine functional groups (i.e., ethylenediamine: EDA) for chemical-mechanical planarization (CMP). This chemical decomposition was performed through two types of hydrolysis reactions, that is, a hydrolysis reaction between OH- ions or R-NH3+ (i.e., EDA with a positively charged amine groups) and oxygen atoms covalently bonded with pyromellitimide on the PI-film-surface. In particular, the degree of slurry adsorption of the PI-film-surface was determined by the EDA concentration in the slurry because of the presence of R-NH3+, that is, a higher EDA concentration resulted in a higher degree of slurry adsorption. In addition, during CMP, the chemical decomposition degree of the PI-film-surface was principally determined by the EDA concentration; that is, the degree of chemical composition was increased noticeably and linearly with the EDA concentration. Thus, the polishing-rate of the PI-film-surface increased notably with the EDA concentration in the CMP slurry.

| S-EPMC8888717 | biostudies-literature

Magnetic nanoparticle-mediated massively parallel mechanical modulation of single-cell behavior.

Project description:We report a technique for generating controllable, time-varying and localizable forces on arrays of cells in a massively parallel fashion. To achieve this, we grow magnetic nanoparticle-dosed cells in defined patterns on micromagnetic substrates. By manipulating and coalescing nanoparticles within cells, we apply localized nanoparticle-mediated forces approaching cellular yield tensions on the cortex of HeLa cells. We observed highly coordinated responses in cellular behavior, including the p21-activated kinase-dependent generation of active, leading edge-type filopodia and biasing of the metaphase plate during mitosis. The large sample size and rapid sample generation inherent to this approach allow the analysis of cells at an unprecedented rate: in a single experiment, potentially tens of thousands of cells can be stimulated for high statistical accuracy in measurements. This technique shows promise as a tool for both cell analysis and control.

| S-EPMC3501759 | biostudies-literature

A novel approach of chemical mechanical polishing using environment-friendly slurry for mercury cadmium telluride semiconductors.

Project description:A novel approach of chemical mechanical polishing (CMP) is developed for mercury cadmium telluride (HgCdTe or MCT) semiconductors. Firstly, fixed-abrasive lapping is used to machine the MCT wafers, and the lapping solution is deionized water. Secondly, the MCT wafers are polished using the developed CMP slurry. The CMP slurry consists of mainly SiO2 nanospheres, H2O2, and malic and citric acids, which are different from previous CMP slurries, in which corrosive and toxic chemical reagents are usually employed. Finally, the polished MCT wafers are cleaned and dried by deionized water and compressed air, respectively. The novel approach of CMP is environment-friendly. Surface roughness Ra, and peak-to-valley (PV) values of 0.45, and 4.74 nm are achieved, respectively on MCT wafers after CMP. The first and second passivating processes are observed in electrochemical measurements on MCT wafers. The fundamental mechanisms of CMP are proposed according to the X-ray photoelectron spectroscopy (XPS) and electrochemical measurements. Malic and citric acids dominate the first passivating process, and the CMP slurry governs the second process. Te(4+)3d peaks are absent after CMP induced by the developed CMP slurry, indicating the removing of oxidized films on MCT wafers, which is difficult to achieve using single H2O2 and malic and citric acids solutions.

| S-EPMC4772544 | biostudies-other

Superlubricity of glycerol by self-sustained chemical polishing.

Project description:An impressive superlow coefficient of friction (CoF) as low as 0.004 (nearly equivalent to the rolling coefficient) was obtained by sliding a steel ball against a tetrahedral amorphous diamond-like carbon (ta-C) coating in glycerol under a boundary lubrication regime. X-ray photoelectron spectroscopy (XPS) and atomic force microscopy (AFM) revealed substantial changes in the surface chemistry and topography in the friction track. As shown by XPS analysis, a transfer of iron atoms from the steel ball to the ta-C layer occurred, forming iron oxy-hydroxide (FeOOH) termination on both surfaces. Between them, theoretical calculations show that a nanometre-thick fluid film consisting of glycerol and its degradation products prevents direct contact between the solid surfaces by nm-thick film EHL lubrication and results in the superlow friction, in agreement with the experiment. Furthermore, molecular dynamics (MD) simulations reveal that hydrogen atoms act as "low-friction brushes" between sliding layers of crystalline FeOOH, resulting also in low friction. A new model of sustainable green superlubricity is proposed. The tribo-formation of FeOOH with glycerol leads to a unique polishing process, which in turn leads to a self-sustained Elasto-Hydrodynamic Lubrication (EHL) regime until the very thin fluid film is no more than a few nanometres thick. At lower thicknesses, the hydroxide layer takes over. Wear of the ta-C coating is negligible, while wear on the steel ball is very moderate and acceptable for many practical applications, such as bio-tribology and the food industry, in which green lubrication is especially needed.

| S-EPMC6472501 | biostudies-literature

OmicsDI is part of the ELIXIR infrastructure

OmicsDI is an Elixir interoperability service. Learn more ›

Tweets

OmicsDI Databases

PRIDE
PeptideAtlas
MassIVE
JPOST Repository
Physiome Model Repository

EGA
EVA
ENA
LINCS
PAXDB
Cell Collective

MetaboLights
Metabolomics Workbench
MetabolomeExpress
GNPS
BioModels
FAIRDOMHub

ArrayExpress
dbGaP
ExpressionAtlas
GEO
NODE

Information

Databases
Help
API
Contact us
Code on GitHub
Terms of use
Submit Data