Dataset Information

Electrothermally Self-Healing Delamination Cracks in Carbon/Epoxy Composites Using Sandwich and Tough Carbon Nanotube/Copolymer Interleaves.

ABSTRACT: Herein, two sandwich and porous interleaves composed of carbon nanotube (CNT) and poly(ethylene-co-methacrylic acid) (EMAA) are proposed, which can simultaneously toughen and self-heal the interlaminar interface of a carbon fiber-reinforced plastic (CFRP) by in situ electrical heating of the CNTs. The critical strain energy release rate modes I (G_IC) and II (G_IIC) are measured to evaluate the toughening and self-healing efficiencies of the interleaves. The results show that compared to the baseline CFRP, the CNT-EMAA-CNT interleaf could increase the G_IC by 24.0% and the G_IIC by 15.2%, respectively, and their respective self-healing efficiencies could reach 109.7-123.5% and 90.6-91.2%; meanwhile, the EMAA-CNT-EMAA interleaf can improve the G_IC and G_IIC by 66.9% and 16.7%, respectively, and the corresponding self-healing efficiencies of the G_IC and G_IIC are 122.7-125.9% and 93.1-94.7%. Thus, both the interleaves show good toughening and self-healing efficiencies on the interlaminar fracture toughness. Specifically, the EMAA-CNT-EMAA interleaf possesses better multi-functionality, i.e., moderate toughening ability but notable self-healing efficiency via electrical heating, which is better than the traditional neat EMAA interleaf and oven-based heating healing method.

SUBMITTER: Ouyang Q

PROVIDER: S-EPMC9611350 | biostudies-literature | 2022 Oct

REPOSITORIES: biostudies-literature

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Electrothermally Self-Healing Delamination Cracks in Carbon/Epoxy Composites Using Sandwich and Tough Carbon Nanotube/Copolymer Interleaves.

Ouyang Qin Q Liu Ling L Wu Zhanjun Z

Polymers 20221014 20

Herein, two sandwich and porous interleaves composed of carbon nanotube (CNT) and poly(ethylene-co-methacrylic acid) (EMAA) are proposed, which can simultaneously toughen and self-heal the interlaminar interface of a carbon fiber-reinforced plastic (CFRP) by in situ electrical heating of the CNTs. The critical strain energy release rate modes I (GIC) and II (GIIC) are measured to evaluate the toughening and self-healing efficiencies of the interleaves. The res ...[more]

PMID: 36297893

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Project description:We present research progress made in developing copper/carbon nanotube composites (Cu/CNT) to fulfil a growing demand for lighter copper substitutes with superior electrical, thermal and mechanical performances. Lighter alternatives to heavy copper electrical and data wiring are needed in automobiles and aircrafts to enhance fuel efficiencies. In electronics, better interconnects and thermal management components than copper with higher current- and heat-stabilities are required to enable device miniaturization with increased functionality. Our literature survey encouragingly indicates that Cu/CNT performances (electrical, thermal and mechanical) reported so far rival that of Cu, proving the material's viability as a Cu alternative. We identify two grand challenges to be solved for Cu/CNT to replace copper in real-life applications. The first grand challenge is to fabricate Cu/CNT with overall performances exceeding that of copper. To address this challenge, we propose research directions to fabricate Cu/CNT closer to ideal composites theoretically predicted to surpass Cu performances (i.e. those containing uniformly distributed Cu and individually aligned CNTs with beneficial CNT-Cu interactions). The second grand challenge is to industrialize and transfer Cu/CNT from lab bench to real-life use. Toward this, we identify and propose strategies to address market-dependent issues for niche/mainstream applications. The current best Cu/CNT performances already qualify for application in niche electronic device markets as high-end interconnects. However, mainstream Cu/CNT application as copper replacements in conventional electronics and in electrical/data wires are long-term goals, needing inexpensive mass-production by methods aligned with existing industrial practices. Mainstream electronics require cheap CNT template-making and electrodeposition procedures, while data/electrical cables require manufacture protocols based on co-electrodeposition or melt-processing. We note (with examples) that initiatives devoted to Cu/CNT manufacturing for both types of mainstream applications are underway. With sustained research on Cu/CNT and accelerating its real-life application, we expect the successful evolution of highly functional, efficient, and sustainable next-generation electrical and electronics systems.

Dataset Information

Electrothermally Self-Healing Delamination Cracks in Carbon/Epoxy Composites Using Sandwich and Tough Carbon Nanotube/Copolymer Interleaves.

Publications

Electrothermally Self-Healing Delamination Cracks in Carbon/Epoxy Composites Using Sandwich and Tough Carbon Nanotube/Copolymer Interleaves.

Similar Datasets

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