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Copper Electrodeposition on a Magnesium Alloy (AZ80) with a U-Shaped Surface.

ABSTRACT: Cu electrodeposition was performed on a cylindrical AZ80 substrate with a U-shaped surface. A uniform deposition of Cu was achieved on an AZ80 electrode via galvanostatic etching, followed by Cu electrodeposition in an eco-friendly alkaline Cu plating bath. Improper wetting and lower rotational speeds of the AZ80 electrode resulted in an uneven Cu deposition at the inner upper site of the U-shaped surface during the Cu electroplating process. This wetting effect could be deduced from the variation in the anodic potential during the galvanostatic etching. The corrosion resistance of the Cu-deposited AZ80 electrode can be considerably improved after Ni electroplating.

SUBMITTER: Huang CA

PROVIDER: S-EPMC5512640 | biostudies-other | 2014 Nov

REPOSITORIES: biostudies-other

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