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Use of vacuum bagging for fabricating thermoplastic microfluidic devices.

ABSTRACT: In this work we present a novel thermal bonding method for thermoplastic microfluidic devices. This simple method employs a modified vacuum bagging technique, a concept borrowed from the aerospace industry, to produce conventional thick substrate microfluidic devices, as well as multi-layer film devices. The bonds produced using this method are superior to those obtained using conventional thermal bonding methods, including thermal lamination, and are capable of sustaining burst pressures in excess of 550 kPa. To illustrate the utility of this method, thick substrate devices were produced, as well as a six-layer film device that incorporated several complex features.

SUBMITTER: Cassano CL

PROVIDER: S-EPMC4256099 | biostudies-literature | 2015 Jan

REPOSITORIES: biostudies-literature

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Use of vacuum bagging for fabricating thermoplastic microfluidic devices.

Cassano Christopher L CL Simon Andrew J AJ Liu Wei W Fredrickson Carl C Fan Z Hugh ZH

Lab on a chip 20150101 1

In this work we present a novel thermal bonding method for thermoplastic microfluidic devices. This simple method employs a modified vacuum bagging technique, a concept borrowed from the aerospace industry, to produce conventional thick substrate microfluidic devices, as well as multi-layer film devices. The bonds produced using this method are superior to those obtained using conventional thermal bonding methods, including thermal lamination, and are capable of sustaining burst pressures in exc ...[more]

PMID: 25329244

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