Ontology highlight
ABSTRACT:
SUBMITTER: Tseng CH
PROVIDER: S-EPMC6045573 | biostudies-literature | 2018 Jul
REPOSITORIES: biostudies-literature
Scientific reports 20180713 1
Cu-to-Cu direct bonding has attracted attention because it has been implemented in CMOS image sensors. Prior to the bonding, the oxides on the Cu surface needs to be removed, yet the surface may oxidize right after cleaning. Thus, oxidation is an inherent issue in the application of Cu direct bonding. Our previous study reported that Cu direct bonding can be achieved below 250 °C by using (111)-oriented nanotwinned Cu because it has the fastest surface diffusivity. However, the oxidation behavio ...[more]