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Imaging the Polymorphic Transformation in a Single Cu?Sn? Grain in a Solder Joint.

ABSTRACT: In-situ observations of the polymorphic transformation in a single targeted Cu?Sn? grain constrained between Sn-0.7 wt % Cu solder and Cu-Cu?Sn phases and the associated structural evolution during a solid-state thermal cycle were achieved via a high-voltage transmission electron microscope (HV-TEM) technique. Here, we show that the monoclinic ?'-Cu?Sn? superlattice reflections appear in the hexagonal ?-Cu?Sn? diffraction pattern upon cooling to isothermal 140 °C from 210 °C. The in-situ real space imaging shows that the ?'-Cu?Sn? contrast pattern is initiated at the grain boundary. This method demonstrates a new approach for further understanding the polymorphic transformation behavior on a real solder joint.

SUBMITTER: Somidin F

PROVIDER: S-EPMC6266603 | biostudies-literature | 2018 Nov

REPOSITORIES: biostudies-literature

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Imaging the Polymorphic Transformation in a Single Cu₆Sn₅ Grain in a Solder Joint.

Somidin Flora F Maeno Hiroshi H Tran Xuan Quy XQ D McDonald Stuart S Mohd Salleh Mohd Arif Anuar MAA Matsumura Syo S Nogita Kazuhiro K

Materials (Basel, Switzerland) 20181109 11

In-situ observations of the polymorphic transformation in a single targeted Cu₆Sn₅ grain constrained between Sn-0.7 wt % Cu solder and Cu-Cu₃Sn phases and the associated structural evolution during a solid-state thermal cycle were achieved via a high-voltage transmission electron microscope (HV-TEM) technique. Here, we show that the monoclinic η'-Cu₆Sn₅ superlattice reflections appear in the hexagonal η-Cu₆Sn₅ diffraction pattern upon cooling to isothermal 140 °C from 210 °C. The in-situ real sp ...[more]

PMID: 30423946

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