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Thermochemical Mechanism of the Epoxy-Glutamic Acid Reaction with Sn-3.0 Ag-0.5 Cu Solder Powder for Electrical Joining

ABSTRACT: An epoxy-based solder paste (ESP) is a promising alternative to conventional solder pastes to improve the reliability of fine-pitch electrical joining because the epoxy encapsulates the solder joint. However, development of an appropriate epoxy formulation and investigation of its reaction mechanism with solder powder is challenging. In this study, we demonstrate a newly designed ESP consisting of diglycidyl ether of bisphenol F (DGEBF) resin, Sn-3.0 Ag-0.5 Cu (SAC305) solder powder, and L-glutamic acid (Glu), which is a proteinogenic amino acid for biosynthesis of proteins in living systems. The mechanism of the thermochemical reaction was explored and tentatively proposed, which reveals that the products of the reaction between SAC305 and Glu function as catalysts for the etherification of epoxides and alcohols produced by chemical bonding between DGEBF and Glu, consequently leading to highly crosslinked polymeric networks and an enhancement of impact resistance. Our findings provide further insight into the mechanism of the reaction between various formulations comprising an epoxy, amino acid, and solder powder, and their potential use as ESPs for electrical joining.

SUBMITTER: Choi G

PROVIDER: S-EPMC8003902 | biostudies-literature |

REPOSITORIES: biostudies-literature

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Effect of FeCoNiCrCu0.5 High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder.

Project description:High-entropy alloys (HEAs) are well known for their excellent high-temperature stability, mechanical properties, and promising resistance against oxidation and corrosion. However, their low-temperature applications are rarely studied, particularly in electronic packaging. In this study, the interfacial reaction between a Sn-3.0Ag-0.5Cu solder and FeCoNiCrCu0.5 HEA substrate was investigated. (Cu0.76, Ni0.24)6Sn5 intermetallic compound was formed the substrate at the interface between the solder and the FeCoNiCrCu0.5 HEA substrate. The average Sn grain size on the HEA substrate was 246 ?m, which was considerably larger than that on a pure Cu substrate. The effect of the substrate on Sn grain size is due to the free energy required for the heterogeneous nucleation of Sn on the FeCoNiCrCu0.5 substrate.

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Project description:High-entropy alloys (HEAs) are promising materials for next-generation applications because of their mechanical properties, excellent high-temperature stability, and resistance against oxidation and corrosion. Although many researchers have investigated high-temperature HEA applications, few have considered low-temperature applications. Here we demonstrate an unprecedented intermetallic compound of (Fe, Cr, Co, Ni, Cu)Sn2 at the interface between Sn-3.0Ag-0.5Cu (SAC) solder and FeCoNiCrCu0.5 HEA substrate after reflow at 400 °C. Significantly suppressed growth of intermetallic compound without detachment from the substrate was observed during thermal aging at 150 °C for 150 h. Sn grains with an average grain size of at least 380 μm are observed. The results reveal a completely new application for the fields of Sn-Ag-Cu solder and HEA materials.

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The quinter-nary thio-phosphate Cs(0.5)Ag(0.5)Nb(2)PS(10).

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Fast formation and growth of high-density Sn whiskers in Mg/Sn-based solder/Mg joints by ultrasonic-assisted soldering: Phenomena, mechanism and prevention.

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