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Suppressed Growth of (Fe, Cr, Co, Ni, Cu)Sn2 Intermetallic Compound at Interface between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu0.5 Substrate during Solid-state Aging.

ABSTRACT: High-entropy alloys (HEAs) are promising materials for next-generation applications because of their mechanical properties, excellent high-temperature stability, and resistance against oxidation and corrosion. Although many researchers have investigated high-temperature HEA applications, few have considered low-temperature applications. Here we demonstrate an unprecedented intermetallic compound of (Fe, Cr, Co, Ni, Cu)Sn2 at the interface between Sn-3.0Ag-0.5Cu (SAC) solder and FeCoNiCrCu0.5 HEA substrate after reflow at 400?°C. Significantly suppressed growth of intermetallic compound without detachment from the substrate was observed during thermal aging at 150?°C for 150?h. Sn grains with an average grain size of at least 380 ?m are observed. The results reveal a completely new application for the fields of Sn-Ag-Cu solder and HEA materials.

SUBMITTER: Shen YA 

PROVIDER: S-EPMC6629638 | biostudies-literature | 2019 Jul

REPOSITORIES: biostudies-literature

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Suppressed Growth of (Fe, Cr<sub>,</sub> Co<sub>,</sub> Ni<sub>,</sub> Cu)Sn<sub>2</sub> Intermetallic Compound at Interface between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu<sub>0.5</sub> Substrate during Solid-state Aging.

Shen Yu-An YA   Lin Chun-Ming CM   Li Jiahui J   Gao Runhua R   Nishikawa Hiroshi H  

Scientific reports 20190715 1

High-entropy alloys (HEAs) are promising materials for next-generation applications because of their mechanical properties, excellent high-temperature stability, and resistance against oxidation and corrosion. Although many researchers have investigated high-temperature HEA applications, few have considered low-temperature applications. Here we demonstrate an unprecedented intermetallic compound of (Fe, Cr, Co, Ni, Cu)Sn<sub>2</sub> at the interface between Sn-3.0Ag-0.5Cu (SAC) solder and FeCoNi  ...[more]

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