Dataset Information

The Influence of Additives on the Interfacial Width and Line Edge Roughness in Block Copolymer Lithography.

ABSTRACT: The challenges of patterning next generation integrated circuits have driven the semiconductor industry to look outside of traditional lithographic methods in order to continue cost effective size scaling. The directed self-assembly (DSA) of block copolymers (BCPs) is a nanofabrication technique used to reduce the periodicity of patterns prepared with traditional optical methods. BCPs with large interaction parameters (? _eff), provide access to smaller pitches and reduced interface widths. Larger ? _eff is also expected to be correlated with reduced line edge roughness (LER), a critical performance parameter in integrated circuits. One approach to increasing ? _eff is blending the BCP with a phase selective additive, such as an Ionic liquid (IL). The IL does not impact the etching rates of either phase, and this enables a direct interrogation of whether the change in interface width driven by higher ? _eff translates into lower LER. The effect of the IL on the layer thickness and interface width of a BCP are examined, along with the corresponding changes in LER in a DSA patterned sample. The results demonstrate that increased ? _eff through additive blending will not necessarily translate to a lower LER, clarifying an important design criterion for future material systems.

SUBMITTER: Sunday DF

PROVIDER: S-EPMC7580231 | biostudies-literature | 2020

REPOSITORIES: biostudies-literature

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The Influence of Additives on the Interfacial Width and Line Edge Roughness in Block Copolymer Lithography.

Sunday Daniel F DF Chen Xuanxuan X Albrecht Thomas R TR Nowak Derek D Delgadillo Paulina Rincon PR Dazai Takahiro T Miyagi Ken K Maehashi Takaya T Yamazaki Akiyoshi A Nealey Paul F PF Kline R Joseph RJ

Chemistry of materials : a publication of the American Chemical Society 20200101 6

The challenges of patterning next generation integrated circuits have driven the semiconductor industry to look outside of traditional lithographic methods in order to continue cost effective size scaling. The directed self-assembly (DSA) of block copolymers (BCPs) is a nanofabrication technique used to reduce the periodicity of patterns prepared with traditional optical methods. BCPs with large interaction parameters (<i>χ</i> <sub>eff</sub>), provide access to smaller pitches and reduced inter ...[more]

PMID: 33100517

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Project description:The directed self-assembly (DSA) of block copolymers (BCPs) is a promising low-cost approach to patterning structures with critical dimensions (CDs) which are smaller than can be achieved by traditional photolithography. The CD of contact holes can be reduced by assembling a cylindrical BCP inside a patterned template and utilizing the native size of the cylinder to dictate the reduced dimensions of the hole. This is a particularly promising application of the DSA technique, but in order for this technology to be realized there is a need for three-dimensional metrology of the internal structure of the patterned BCP in order to understand how template properties and processing conditions impact BCP assembly. This is a particularly challenging problem for traditional metrologies owing to the three-dimensional nature of the structure and the buried features. By utilizing small-angle X-ray scattering and changing the angle between the incident beam and sample we can reconstruct the three-dimensional shape profile of the empty template and the residual polymer after self-assembly and removal of one of the phases. A two-dimensional square grid pattern of the holes results in scattering in both in-plane directions, which is simplified by converting to a radial geometry. The shape is then determined by simulating the scattering from a model and iterating that model until the simulated and experimental scattering profiles show a satisfactory match. Samples with two different processing conditions are characterized in order to demonstrate the ability of the technique to evaluate critical features such as residual layer thickness and sidewall height. It was found that the samples had residual layer thicknesses of 15.9 ± 3.2 nm and 4.5 ± 2.2 nm, which were clearly distinguished between the two different DSA processes and in good agreement with focused ion beam scanning transmission electron microscopy (FIBSTEM) observations. The advantage of the X-ray measurements is that FIBSTEM characterizes around ten holes, while there are of the order of 800 000 holes illuminated by the X-ray beam.

Dataset Information

The Influence of Additives on the Interfacial Width and Line Edge Roughness in Block Copolymer Lithography.

Publications

The Influence of Additives on the Interfacial Width and Line Edge Roughness in Block Copolymer Lithography.

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