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Highly Thermal Conductive and Electrical Insulating Epoxy Composites with a Three-Dimensional Filler Network by Sintering Silver Nanowires on Aluminum Nitride Surface.

ABSTRACT: In this study, a new fabrication technique for three-dimensional (3D) filler networks was employed for the first time to prepare thermally conductive composites. A silver nanowire (AgNW)- aluminum nitride (AlN) (AA) filler was produced by a polyol method and hot-pressed in mold to connect the adjacent fillers by sintering AgNWs on the AlN surface. The sintered AA filler formed a 3D network, which was subsequently impregnated with epoxy (EP) resin. The fabricated EP/AA 3D network composite exhibited a perpendicular direction thermal conductivity of 4.49 W m^-1 K^-1 at a filler content of 400 mg (49.86 vol.%) representing an enhancement of 1973% with respect to the thermal conductivity of neat EP (0.22 W m^-1 K^-1). Moreover, the EP/AA decreased the operating temperature of the central processing unit (CPU) from 86.2 to 64.6 °C as a thermal interface material (TIM). The thermal stability was enhanced by 27.28% (99 °C) and the composites showed insulating after EP infiltration owing to the good insulation properties of AlN and EP. Therefore, these fascinating thermal and insulating performances have a great potential for next generation heat management application.

SUBMITTER: Lee W

PROVIDER: S-EPMC7956527 | biostudies-literature |

REPOSITORIES: biostudies-literature

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Highly Thermally Conductive Epoxy Composites with AlN/BN Hybrid Filler as Underfill Encapsulation Material for Electronic Packaging.

Project description:In this study, the effects of a hybrid filler composed of zero-dimensional spherical AlN particles and two-dimensional BN flakes on the thermal conductivity of epoxy resin were studied. The thermal conductivity (TC) of the pristine epoxy matrix (EP) was 0.22 W/(m K), while the composite showed the TC of 10.18 W/(m K) at the 75 wt% AlN-BN hybrid filler loading, which is approximately a 46-fold increase. Moreover, various essential application properties were examined, such as the viscosity, cooling rate, coefficient of thermal expansion (CTE), morphology, and electrical properties. In particular, the AlN-BN/EP composite showed higher thermal stability and lower CTE (22.56 ppm/°C) than pure epoxy. Overall, the demonstrated outstanding thermal performance is appropriate for the production of electronic packaging materials, including next-generation flip-chip underfills.

| S-EPMC9320615 | biostudies-literature

The use of polyimide-modified aluminum nitride fillers in AlN@PI/epoxy composites with enhanced thermal conductivity for electronic encapsulation.

Project description:Polymer modified fillers in composites has attracted the attention of numerous researchers. These fillers are composed of core-shell structures that exhibit enhanced physical and chemical properties that are associated with shell surface control and encapsulated core materials. In this study, we have described an apt method to prepare polyimide (PI)-modified aluminum nitride (AlN) fillers, AlN@PI. These fillers are used for electronic encapsulation in high performance polymer composites. Compared with that of untreated AlN composite, these AlN@PI/epoxy composites exhibit better thermal and dielectric properties. At 40?wt% of filler loading, the highest thermal conductivity of AlN@PI/epoxy composite reached 2.03?W/mK. In this way, the thermal conductivity is approximately enhanced by 10.6 times than that of the used epoxy matrix. The experimental results exhibiting the thermal conductivity of AlN@PI/epoxy composites were in good agreement with the values calculated from the parallel conduction model. This research work describes an effective pathway that modifies the surface of fillers with polymer coating. Furthermore, this novel technique improves the thermal and dielectric properties of fillers and these can be used extensively for electronic packaging applications.

| S-EPMC3998031 | biostudies-literature

Enhanced thermal conductivity of epoxy composites filled with silicon carbide nanowires.

Project description:In this study, we report a facile approach to fabricate epoxy composite incorporated with silicon carbide nanowires (SiC NWs). The thermal conductivity of epoxy/SiC NWs composites was thoroughly investigated. The thermal conductivity of epoxy/SiC NWs composites with 3.0 wt% filler reached 0.449 Wm-1 K-1, approximately a 106% enhancement as compared to neat epoxy. In contrast, the same mass fraction of silicon carbide micron particles (SiC MPs) incorporated into epoxy matrix showed less improvement on thermal conduction properties. This is attributed to the formation of effective heat conduction pathways among SiC NWs as well as a strong interaction between the nanowires and epoxy matrix. In addition, the thermal properties of epoxy/SiC NWs composites were also improved. These results demonstrate that we developed a novel approach to enhance the thermal conductivity of the polymer composites which meet the requirement for the rapid development of the electronic devices.

| S-EPMC5453999 | biostudies-literature

Direction Dependent Electrical Conductivity of Polymer/Carbon Filler Composites.

Project description:The method of measuring electrical volume resistivity in different directions was applied to characterize the filler orientation in melt mixed polymer composites containing different carbon fillers. For this purpose, various kinds of fillers with different geometries and aspect ratios were selected, namely carbon black (CB), graphite (G) and expanded graphite (EG), branched multiwalled carbon nanotubes (b-MWCNTs), non-branched multiwalled carbon nanotubes (MWCNTs), and single-walled carbon nanotubes (SWCNTs). As it is well known that the shaping process also plays an important role in the achieved electrical properties, this study compares results for compression molded plates with random filler orientations in the plane as well as extruded films, which have, moreover, conductivity differences between extrusion direction and perpendicular to the plane. Additionally, the polymer matrix type (poly (vinylidene fluoride) (PVDF), acrylonitrile butadiene styrene (ABS), polyamide 6 (PA6)) and filler concentration were varied. For the electrical measurements, a device able to measure the electrical conductivity in two directions was developed and constructed. The filler orientation was analyzed using the ratio σin/th calculated as in-plane conductivity σin-plane (σin) divided by through-plane conductivity σthrough-plane (σth). The ratio σin/th is expected to increase with more pronounced filler orientation in the processing direction. In the extruded films, alignment within the plane was assigned by dividing the in-plane conductivity in the extrusion direction (x) by the in-plane conductivity perpendicular to the extrusion direction (y). The conductivity ratios depend on filler type and concentration and are higher the higher the filler aspect ratio and the closer the filler content is to the percolation concentration.

| S-EPMC6523830 | biostudies-other

Thermal Conductivity and Cure Kinetics of Epoxy-Boron Nitride Composites-A Review.

Project description:Epoxy resin composites filled with thermally conductive but electrically insulating particles play an important role in the thermal management of modern electronic devices. Although many types of particles are used for this purpose, including oxides, carbides and nitrides, one of the most widely used fillers is boron nitride (BN). In this review we concentrate specifically on epoxy-BN composites for high thermal conductivity applications. First, the cure kinetics of epoxy composites in general, and of epoxy-BN composites in particular, are discussed separately in terms of the effects of the filler particles on cure parameters and the cured composite. Then, several fundamental aspects of epoxy-BN composites are discussed in terms of their effect on thermal conductivity. These aspects include the following: the filler content; the type of epoxy system used for the matrix; the morphology of the filler particles (platelets, agglomerates) and their size and concentration; the use of surface treatments of the filler particles or of coupling agents; and the composite preparation procedures, for example whether or not solvents are used for dispersion of the filler in the matrix. The dependence of thermal conductivity on filler content, obtained from over one hundred reports in the literature, is examined in detail, and an attempt is made to categorise the effects of the variables and to compare the results obtained by different procedures.

| S-EPMC7476057 | biostudies-literature

Shear-Assisted Production of Few-Layer Boron Nitride Nanosheets by Supercritical CO<sub>2</sub> Exfoliation and Its Use for Thermally Conductive Epoxy Composites.

Project description:Boron nitride nanosheets (BNNS) hold the similar two-dimensional structure as graphene and unique properties complementary to graphene, which makes it attractive in application ranging from electronics to energy storage. The exfoliation of boron nitride (BN) still remains challenge and hinders the applications of BNNS. In this work, the preparation of BNNS has been realized by a shear-assisted supercritical CO2 exfoliation process, during which supercritical CO2 intercalates and diffuses between boron nitride layers, and then the exfoliation of BN layers is obtained in the rapid depressurization process by overcoming the van der Waals forces. Our results indicate that the bulk boron nitride has been successfully exfoliated into thin nanosheets with an average 6 layers. It is found that the produced BNNS is well-dispersed in isopropyl alcohol (IPA) with a higher extinction coefficient compared with the bulk BN. Moreover, the BNNS/epoxy composite used as thermal interface materials has been prepared. The introduction of BNNS results in a 313% enhancement in thermal conductivity. Our results demonstrate that BNNS produced by supercritical CO2 exfoliation show great potential applications for heat dissipation of high efficiency electronics.

| S-EPMC5736726 | biostudies-literature

Surface Modification of Aluminum Nitride to Fabricate Thermally Conductive poly(Butylene Succinate) Nanocomposite.

Project description:Biodegradable polymers and their composites are considered promising materials for replacing conventional polymer plastics in various engineering fields. In this study, poly(butylene succinate) (PBS) composites filled with 5% aluminum nitride nanoparticles were successfully fabricated. The aluminum nitride nanoparticles were surface-modified to improve their interaction with the PBS matrix. Field-emission scanning electron microscopy revealed that the nanocomposites with surface-modified nanoparticles had better interface interaction and dispersion in the polymer matrix than those with untreated nanoparticles. The PBS/modified AlN nanocomposites exhibited maximal thermal conductivity enhancement, 63.7%, compared to the neat PBS. In addition, other thermomechanical properties of the PBS nanocomposites were investigated in this study. The nanocomposites also showed a superior storage modulus compared to the neat PBS matrix. In this work, a PBS nanocomposite with suitable thermal conductivity that can be used in various electronic fields was fabricated.

| S-EPMC6401904 | biostudies-literature

Hybrid Epoxy Composites with Both Powder and Fiber Filler: A Review of Mechanical and Thermomechanical Properties.

Project description:Fiber-reinforced epoxy composites are used in various branches of industry because of their favorable strength and thermal properties, resistance to chemical and atmospheric conditions, as well as low specific gravity. This review discusses the mechanical and thermomechanical properties of hybrid epoxy composites that were reinforced with glass, carbon, and basalt fabric modified with powder filler. The modification of the epoxy matrix mainly leads to an improvement in its adhesion to the layers of reinforcing fibers in the form of laminate fabrics. Some commonly used epoxy matrix modifiers in powder form include carbon nanotubes, graphene, nanoclay, silica, and natural fillers. Fiber fabric reinforcement can be unidirectional, multidirectional, biaxial, or have plain, twill, and satin weave, etc. Commonly used methods of laminating epoxy composites are hand lay-up process, resin transfer molding, vacuum-assisted resin transfer molding, and hot or cold pressing. The following review is a valuable source of information on multiscale epoxy composites due to the multitude of technological and material solutions.

| S-EPMC7215734 | biostudies-literature

Nonisothermal Crystallization of Surface-Treated Alumina and Aluminum Nitride-Filled Polylactic Acid Hybrid Composites.

Project description:This work investigates the nonisothermal crystallization and melting behavior of polylactic acid (PLA), filled with treated and untreated alumina and nano-aluminum nitride hybrid composites. Analysis by attenuated total reflectance Fourier transform infrared spectroscopy revealed that the treated fillers and the PLA matrix developed a good interaction. The crystallization and melting behaviors of the PLA hybrid composites were investigated using differential scanning calorimetry showed that the degree of crystallinity increased with the addition of hybrid fillers. Unlike the untreated PLA composites, the complete crystallization of the treated PLA hybrid composites hindered cold crystallization during the second heating cycle. The crystallization kinetics studied using the Avrami model indicated that the crystallization rate of PLA was affected by the inclusion of filler particles. X-ray diffraction analysis confirmed crystal formation with the incorporation of filler particles. The inclusion of nano-aluminum nitride (AlN) and the increase in the crystallinity led to an improvement of the storage modulus.

| S-EPMC6630763 | biostudies-literature

A novel method based on selective laser sintering for preparing high-performance carbon fibres/polyamide12/epoxy ternary composites.

Project description:A novel method based on selective laser sintering (SLS) process is proposed for the first time to prepare complex and high-performance carbon fibres/polyamide12/epoxy (CF/PA12/EP) ternary composites. The procedures are briefly described as follows: prepare polyamide12 (PA12) coated carbon fibre (CF) composite powder; build porous green parts by SLS; infiltrate the green parts with high-performance thermosetting epoxy (EP) resin; and finally cure the resin at high temperature. The obtained composites are a ternary composite system consisting of the matrix of novolac EP resin, the reinforcement of CFs and the transition thin layer of PA12 with a thickness of 595?nm. The SEM images and micro-CT analysis prove that the ternary system is a three-dimensional co-continuous structure and the reinforcement of CFs are well dispersed in the matrix of EP with the volume fraction of 31%. Mechanical tests show that the composites fabricated by this method yield an ultimate tensile strength of 101.03?MPa and a flexural strength of 153.43?MPa, which are higher than those of most of the previously reported SLS materials. Therefore, the process proposed in this paper shows great potential for manufacturing complex, lightweight and high-performance CF reinforced composite components in aerospace, automotive industries and other areas.

| S-EPMC5030666 | biostudies-literature

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