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Highly Thermal Conductive and Electrical Insulating Epoxy Composites with a Three-Dimensional Filler Network by Sintering Silver Nanowires on Aluminum Nitride Surface.

ABSTRACT: In this study, a new fabrication technique for three-dimensional (3D) filler networks was employed for the first time to prepare thermally conductive composites. A silver nanowire (AgNW)- aluminum nitride (AlN) (AA) filler was produced by a polyol method and hot-pressed in mold to connect the adjacent fillers by sintering AgNWs on the AlN surface. The sintered AA filler formed a 3D network, which was subsequently impregnated with epoxy (EP) resin. The fabricated EP/AA 3D network composite exhibited a perpendicular direction thermal conductivity of 4.49 W m^-1 K^-1 at a filler content of 400 mg (49.86 vol.%) representing an enhancement of 1973% with respect to the thermal conductivity of neat EP (0.22 W m^-1 K^-1). Moreover, the EP/AA decreased the operating temperature of the central processing unit (CPU) from 86.2 to 64.6 °C as a thermal interface material (TIM). The thermal stability was enhanced by 27.28% (99 °C) and the composites showed insulating after EP infiltration owing to the good insulation properties of AlN and EP. Therefore, these fascinating thermal and insulating performances have a great potential for next generation heat management application.

SUBMITTER: Lee W

PROVIDER: S-EPMC7956527 | biostudies-literature |

REPOSITORIES: biostudies-literature

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Highly Thermally Conductive Epoxy Composites with AlN/BN Hybrid Filler as Underfill Encapsulation Material for Electronic Packaging.

Project description:In this study, the effects of a hybrid filler composed of zero-dimensional spherical AlN particles and two-dimensional BN flakes on the thermal conductivity of epoxy resin were studied. The thermal conductivity (TC) of the pristine epoxy matrix (EP) was 0.22 W/(m K), while the composite showed the TC of 10.18 W/(m K) at the 75 wt% AlN-BN hybrid filler loading, which is approximately a 46-fold increase. Moreover, various essential application properties were examined, such as the viscosity, cooling rate, coefficient of thermal expansion (CTE), morphology, and electrical properties. In particular, the AlN-BN/EP composite showed higher thermal stability and lower CTE (22.56 ppm/°C) than pure epoxy. Overall, the demonstrated outstanding thermal performance is appropriate for the production of electronic packaging materials, including next-generation flip-chip underfills.

| S-EPMC9320615 | biostudies-literature

Vertically Aligned Silicon Carbide Nanowires/Boron Nitride Cellulose Aerogel Networks Enhanced Thermal Conductivity and Electromagnetic Absorbing of Epoxy Composites.

Project description:With the innovation of microelectronics technology, the heat dissipation problem inside the device will face a severe test. In this work, cellulose aerogel (CA) with highly enhanced thermal conductivity (TC) in vertical planes was successfully obtained by constructing a vertically aligned silicon carbide nanowires (SiC NWs)/boron nitride (BN) network via the ice template-assisted strategy. The unique network structure of SiC NWs connected to BN ensures that the TC of the composite in the vertical direction reaches 2.21 W m-1 K-1 at a low hybrid filler loading of 16.69 wt%, which was increased by 890% compared to pure epoxy (EP). In addition, relying on unique porous network structure of CA, EP-based composite also showed higher TC than other comparative samples in the horizontal direction. Meanwhile, the composite exhibits good electrically insulating with a volume electrical resistivity about 2.35 × 1011 Ω cm and displays excellent electromagnetic wave absorption performance with a minimum reflection loss of - 21.5 dB and a wide effective absorption bandwidth (< - 10 dB) from 8.8 to 11.6 GHz. Therefore, this work provides a new strategy for manufacturing polymer-based composites with excellent multifunctional performances in microelectronic packaging applications.

| S-EPMC9056589 | biostudies-literature

The use of polyimide-modified aluminum nitride fillers in AlN@PI/epoxy composites with enhanced thermal conductivity for electronic encapsulation.

Project description:Polymer modified fillers in composites has attracted the attention of numerous researchers. These fillers are composed of core-shell structures that exhibit enhanced physical and chemical properties that are associated with shell surface control and encapsulated core materials. In this study, we have described an apt method to prepare polyimide (PI)-modified aluminum nitride (AlN) fillers, AlN@PI. These fillers are used for electronic encapsulation in high performance polymer composites. Compared with that of untreated AlN composite, these AlN@PI/epoxy composites exhibit better thermal and dielectric properties. At 40 wt% of filler loading, the highest thermal conductivity of AlN@PI/epoxy composite reached 2.03 W/mK. In this way, the thermal conductivity is approximately enhanced by 10.6 times than that of the used epoxy matrix. The experimental results exhibiting the thermal conductivity of AlN@PI/epoxy composites were in good agreement with the values calculated from the parallel conduction model. This research work describes an effective pathway that modifies the surface of fillers with polymer coating. Furthermore, this novel technique improves the thermal and dielectric properties of fillers and these can be used extensively for electronic packaging applications.

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Designable core-shell graphite particles for thermally conductive and electrically insulating polymer composites.

Project description:Electrically insulating graphite particles were prepared by coating graphite with electrically insulating materials via a two-step mechanical mixing process. Graphite particles were treated with a binder in the 1st mixing process and coated with an electrically insulating particle in the 2nd mixing process under high shear forces within a short processing time (below 1 min). Micron-sized graphite particles were successfully coated with various inorganic particles of appropriate particle diameter. Talc and boron nitride exhibited good affinities with graphite and formed effective coating layers to render reliable electrical insulation. Graphite coated with talc and boron nitride exhibited a high volume resistivity, greater than 109 Ω cm. The insulating property was retained even after compounding and moulding the coated graphite particles with a polymer. The two-step coating process under high shear forces is a promising method for production of coated graphite particles.

| S-EPMC9080288 | biostudies-literature

Enhanced thermal conductivity of epoxy composites filled with silicon carbide nanowires.

Project description:In this study, we report a facile approach to fabricate epoxy composite incorporated with silicon carbide nanowires (SiC NWs). The thermal conductivity of epoxy/SiC NWs composites was thoroughly investigated. The thermal conductivity of epoxy/SiC NWs composites with 3.0 wt% filler reached 0.449 Wm-1 K-1, approximately a 106% enhancement as compared to neat epoxy. In contrast, the same mass fraction of silicon carbide micron particles (SiC MPs) incorporated into epoxy matrix showed less improvement on thermal conduction properties. This is attributed to the formation of effective heat conduction pathways among SiC NWs as well as a strong interaction between the nanowires and epoxy matrix. In addition, the thermal properties of epoxy/SiC NWs composites were also improved. These results demonstrate that we developed a novel approach to enhance the thermal conductivity of the polymer composites which meet the requirement for the rapid development of the electronic devices.

| S-EPMC5453999 | biostudies-literature

Direction Dependent Electrical Conductivity of Polymer/Carbon Filler Composites.

Project description:The method of measuring electrical volume resistivity in different directions was applied to characterize the filler orientation in melt mixed polymer composites containing different carbon fillers. For this purpose, various kinds of fillers with different geometries and aspect ratios were selected, namely carbon black (CB), graphite (G) and expanded graphite (EG), branched multiwalled carbon nanotubes (b-MWCNTs), non-branched multiwalled carbon nanotubes (MWCNTs), and single-walled carbon nanotubes (SWCNTs). As it is well known that the shaping process also plays an important role in the achieved electrical properties, this study compares results for compression molded plates with random filler orientations in the plane as well as extruded films, which have, moreover, conductivity differences between extrusion direction and perpendicular to the plane. Additionally, the polymer matrix type (poly (vinylidene fluoride) (PVDF), acrylonitrile butadiene styrene (ABS), polyamide 6 (PA6)) and filler concentration were varied. For the electrical measurements, a device able to measure the electrical conductivity in two directions was developed and constructed. The filler orientation was analyzed using the ratio σin/th calculated as in-plane conductivity σin-plane (σin) divided by through-plane conductivity σthrough-plane (σth). The ratio σin/th is expected to increase with more pronounced filler orientation in the processing direction. In the extruded films, alignment within the plane was assigned by dividing the in-plane conductivity in the extrusion direction (x) by the in-plane conductivity perpendicular to the extrusion direction (y). The conductivity ratios depend on filler type and concentration and are higher the higher the filler aspect ratio and the closer the filler content is to the percolation concentration.

| S-EPMC6523830 | biostudies-other

Thermal Conductivity and Cure Kinetics of Epoxy-Boron Nitride Composites-A Review.

Project description:Epoxy resin composites filled with thermally conductive but electrically insulating particles play an important role in the thermal management of modern electronic devices. Although many types of particles are used for this purpose, including oxides, carbides and nitrides, one of the most widely used fillers is boron nitride (BN). In this review we concentrate specifically on epoxy-BN composites for high thermal conductivity applications. First, the cure kinetics of epoxy composites in general, and of epoxy-BN composites in particular, are discussed separately in terms of the effects of the filler particles on cure parameters and the cured composite. Then, several fundamental aspects of epoxy-BN composites are discussed in terms of their effect on thermal conductivity. These aspects include the following: the filler content; the type of epoxy system used for the matrix; the morphology of the filler particles (platelets, agglomerates) and their size and concentration; the use of surface treatments of the filler particles or of coupling agents; and the composite preparation procedures, for example whether or not solvents are used for dispersion of the filler in the matrix. The dependence of thermal conductivity on filler content, obtained from over one hundred reports in the literature, is examined in detail, and an attempt is made to categorise the effects of the variables and to compare the results obtained by different procedures.

| S-EPMC7476057 | biostudies-literature

Shear-Assisted Production of Few-Layer Boron Nitride Nanosheets by Supercritical CO<sub>2</sub> Exfoliation and Its Use for Thermally Conductive Epoxy Composites.

Project description:Boron nitride nanosheets (BNNS) hold the similar two-dimensional structure as graphene and unique properties complementary to graphene, which makes it attractive in application ranging from electronics to energy storage. The exfoliation of boron nitride (BN) still remains challenge and hinders the applications of BNNS. In this work, the preparation of BNNS has been realized by a shear-assisted supercritical CO2 exfoliation process, during which supercritical CO2 intercalates and diffuses between boron nitride layers, and then the exfoliation of BN layers is obtained in the rapid depressurization process by overcoming the van der Waals forces. Our results indicate that the bulk boron nitride has been successfully exfoliated into thin nanosheets with an average 6 layers. It is found that the produced BNNS is well-dispersed in isopropyl alcohol (IPA) with a higher extinction coefficient compared with the bulk BN. Moreover, the BNNS/epoxy composite used as thermal interface materials has been prepared. The introduction of BNNS results in a 313% enhancement in thermal conductivity. Our results demonstrate that BNNS produced by supercritical CO2 exfoliation show great potential applications for heat dissipation of high efficiency electronics.

| S-EPMC5736726 | biostudies-literature

Thermally Conductive and Electrically Insulating Polymer-Based Composites Heat Sinks Fabricated by Fusion Deposition Modeling.

Project description:This study explores the potential of novel boron nitride (BN) microplatelet composites with combined thermal conduction and electrical insulation properties. These composites are manufactured through Fusion Deposition Modeling (FDM), and their application for thermal management in electronic devices is demonstrated. The primary focus of this work is, therefore, the investigation of the thermoplastic composite properties to show the 3D printing of lightweight polymeric heat sinks with remarkable thermal performance. By comparing various microfillers, including BN and MgO particles, their effects on material properties and alignment within the polymer matrix during filament fabrication and FDM processing are analyzed. The characterization includes the evaluation of morphology, thermal conductivity, and mechanical and electrical properties. Particularly, a composite with 32 wt% of BN microplatelets shows an in-plane thermal conductivity of 1.97 W m-1 K-1, offering electrical insulation and excellent printability. To assess practical applications, lightweight pin fin heat sinks using these composites are designed and 3D printed. Their thermal performance is evaluated via thermography under different heating conditions. The findings are very promising for an efficient and cost-effective fabrication of thermal devices, which can be obtained through extrusion-based Additive Manufacturing (AM), such as FDM, and exploited as enhanced thermal management solutions in electronic devices.

| S-EPMC10857692 | biostudies-literature

Surface Modification of Aluminum Nitride to Fabricate Thermally Conductive poly(Butylene Succinate) Nanocomposite.

Project description:Biodegradable polymers and their composites are considered promising materials for replacing conventional polymer plastics in various engineering fields. In this study, poly(butylene succinate) (PBS) composites filled with 5% aluminum nitride nanoparticles were successfully fabricated. The aluminum nitride nanoparticles were surface-modified to improve their interaction with the PBS matrix. Field-emission scanning electron microscopy revealed that the nanocomposites with surface-modified nanoparticles had better interface interaction and dispersion in the polymer matrix than those with untreated nanoparticles. The PBS/modified AlN nanocomposites exhibited maximal thermal conductivity enhancement, 63.7%, compared to the neat PBS. In addition, other thermomechanical properties of the PBS nanocomposites were investigated in this study. The nanocomposites also showed a superior storage modulus compared to the neat PBS matrix. In this work, a PBS nanocomposite with suitable thermal conductivity that can be used in various electronic fields was fabricated.

| S-EPMC6401904 | biostudies-literature

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